Kulicke & Soffa AT Premier

Models in this family

1. 

   AT Premier

   The Kulicke & Soffa AT Premier is a wire bonder used in semiconductor packaging and bonding.

   Cited variants

   Designation	Generation	Vintage	Changes	Source
   AT Premier PLUS	—	—	The AT Premier PLUS is a wafer level bonder. It is able to bond up to 300 mm diameter wafers, ceramics or substrates. Bond placement accuracy is ±3.5 µm @3 sigma for 200 mm work piece and ±5.0 µm @3 sigma for 300 mm work piece. It features advanced hardware and software controls, best-in-class low temperature gold bumping, improved serviceability, programmable power supply system with back-up, and optional copper or silver alloy capability and kits. Optional basic wire bonding capability. Smallest footprint in the market.	zaratech.biz[1]
   AT Premier Lite	—	—	The AT Premier Lite is a wafer level bonder. It handles wafers from 4" to 12" (up to 200 mm diameter) wafers, ceramics, or substrates. Bond placement accuracy is ±3.5 µm @3 sigma for 200 mm work piece. It features best-in-class low temperature gold bumping, improved serviceability, programmable power supply system with back-up, optional copper or silver alloy capability and kits, and compact design. Optional 4" dual ramp chuck.	zaratech.biz[2]

Sources