Kulicke & Soffa
AT Premier
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
The Kulicke & Soffa AT Premier is a wire bonder used in semiconductor packaging. The AT Premier is part of the Power Series platform. Variants include the AT Premier PLUS and AT Premier Lite.[1][2]
What it is
How it works
General reference — not yet source-verifiedA wire bonder joins conductive interconnects between a semiconductor die and a package or substrate by placing bond wires at selected bond sites.
Wire bonding equipment places fine interconnects under controlled motion, force, and energy so the die can be electrically connected to the next assembly level.
Where it fits in the process flow
General reference — not yet source-verifiedWire bonding belongs in back-end assembly after device fabrication and die preparation.
Applications
What do the numbers mean?
Configuration & options3
Vintage & configurations
Documented models & variants
| Designation | Generation | Vintage | Changes | Source |
|---|---|---|---|---|
| AT Premier PLUS | — | — | The AT Premier PLUS is a wafer level bonder. It is able to bond up to 300 mm diameter wafers, ceramics or substrates. Bond placement accuracy is ±3.5 µm @3 sigma for 200 mm work piece and ±5.0 µm @3 sigma for 300 mm work piece. It features advanced hardware and software controls, best-in-class low temperature gold bumping, improved serviceability, programmable power supply system with back-up, and optional copper or silver alloy capability and kits. Optional basic wire bonding capability. Smallest footprint in the market. | zaratech.biz[1] |
| AT Premier Lite | — | — | The AT Premier Lite is a wafer level bonder. It handles wafers from 4" to 12" (up to 200 mm diameter) wafers, ceramics, or substrates. Bond placement accuracy is ±3.5 µm @3 sigma for 200 mm work piece. It features best-in-class low temperature gold bumping, improved serviceability, programmable power supply system with back-up, optional copper or silver alloy capability and kits, and compact design. Optional 4" dual ramp chuck. | zaratech.biz[2] |
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
Not publicly documented
The following facts about the AT Premier are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the AT Premier are on record.
Answerable by: OEM historical records or a trade-press announcement
The control-system platform and OS era of the AT Premier are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the AT Premier are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the AT Premier is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the AT Premier are on record.
Answerable by: an OEM parts catalog or a service engineer
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (5)Every fact above is drawn from these public sources
- [1]zaratech.biz — zaratech.bizzaratech.biz
- [2]zaratech.biz — zaratech.bizzaratech.biz
- [3]Inventory photo
- [4]Inventory photo
- [5]waferpedia.com — waferpedia.comwaferpedia.com
Last updated Oct 12, 2026.
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