Waferpedia

Tool family

MRSI 705HF

MRSIPackaging & Bonding1 entry

The MRSI-705HF is a 5-micron high force die bonder with a heated bond head that can apply up to 500N of force and top-side heating up to 400°C.

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Models in this family

  1. 705HF

    The MRSI-705HF is a 5-micron high force die bonder with a heated bond head that can apply up to 500N of force and top-side heating up to 400°C.