MRSI

705HF

Packaging & Bonding MRSI 705HF family

Research Quality: 40% complete

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705HF — web.archive.org — Fig. 01705HFweb.archive.org^[1]

Performance

+/- 5 microns or better^[1]

Optics

0.1-micron resolution^[1]

Control era

Windows

What is it?

The MRSI-705HF is described as a 5-micron high force die bonder for advanced packaging and assembly applications. The source states that it uses a heated bond head, supports up to 500N bonding force, and provides heating up to 400°C from the top, with features including a 700 sq.in work area, wafer picking with wafer mapping and ink dot recognition, and configurable options for eutectic bonding and in-line integration.

What can it run?

Process applications and technology nodes documented for this tool.

Sintering for power semiconductors
Thermocompression bonding for IC packaging
Advanced packaging
Eutectic bonding
Gold Silicon bonding
Gold Tin bonding
Gold Germanium bonding
Sub-mounts
TO headers
Butterfly packages
Photonics/optical assemblies
High power devices such as amplifiers

What do the numbers mean?

Optics & imaging1

Linear encoder resolution: 0.1-micron resolution^[1]

Performance1

Placement accuracy: +/- 5 microns or better^[1]

Control & software1

Control platform: Windows GUI^[1]

Configuration & options10

Machine type: 5-micron high force die bonder^[1]
Bond head: Heated bond head^[1]
Maximum force: Up to 500N^[1]
Top heating temperature: Up to 400°C^[1]
Work area: 700 sq.in^[1]
Maximum waffle packs: Up to 90 when using the Sector Plate Shuttle^[1]
Force at component: As low as 10 grams^[1]
Motion axes: Up to 32 axes of motion^[1]
Tool bank: Thirteen-position tool bank with fast automatic tool change^[1]
Integration: SMEMA compatibility^[1]

Vintage & configurations

Control-system eraWindows^[1]

Interested in this tool?

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Where are the manuals?

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Not publicly documented

Field notes

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Not publicly documented

The following facts about the 705HF are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 705HF are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the 705HF are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
No publicly documented failure modes or field errata for the 705HF are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 705HF is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the 705HF are on record.
Answerable by: an OEM parts catalog or a service engineer