MRSI

705HF

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The MRSI-705HF is a 5-micron high force die bonder. The MRSI-705HF applies up to 500N of force during bonding. The MRSI-705HF heats up to 400°C from the top.^[1]^[2]^[3]

705HF — web.archive.org — Fig. 01705HFweb.archive.org^[1]

Performance

+/- 5 microns or better^[1]

Optics

0.1-micron resolution^[1]

Control era

Windows

What it is

General reference — not yet source-verified

The MRSI 705HF is a high force die bonder in the packaging and bonding class of semiconductor assembly equipment. Die bonders place singulated dies or other small components onto substrates, packages, or submounts with controlled position, force, heat, and process sequencing. Die bonders are used after die singulation and incoming material preparation, and before later assembly, cure, sealing, wire interconnect, or final test steps.

Where it fits in the process flow

General reference — not yet source-verified

Die bonding sits in assembly flow after wafer processing, dicing, inspection, and material preparation. Die bonding creates the physical attach and positional registration between a die and its target carrier or substrate. Later operations can include cure, reflow, lid attach, wire bonding, underfill, encapsulation, test, and module build, depending on the package architecture.

Applications

General reference — not yet source-verified

Die bonders are used where small components must be attached with controlled alignment and bond formation. Typical uses include semiconductor packaging, photonic assembly, sensor packaging, microwave and radio frequency modules, power devices, and hybrid assemblies that require accurate die placement and process-specific force and thermal control.

Sintering for power semiconductors
Thermocompression bonding for IC packaging
Advanced packaging
Eutectic bonding
Gold Silicon bonding
Gold Tin bonding
Gold Germanium bonding
Sub-mounts
TO headers
Butterfly packages
Photonics/optical assemblies
High power devices such as amplifiers

What do the numbers mean?

Optics & imaging1

Linear encoder resolution: 0.1-micron resolution^[1]

Performance1

Placement accuracy: +/- 5 microns or better^[1]

Control & software1

Control platform: Windows GUI^[1]2 sources

Configuration & options10

Machine type: 5-micron high force die bonder^[1]
Bond head: Heated bond head^[1]
Maximum force: Up to 500N^[1]2 sources
Top heating temperature: Up to 400°C^[1]2 sources
Work area: 700 sq.in^[1]
Maximum waffle packs: Up to 90 when using the Sector Plate Shuttle^[1]
Force at component: As low as 10 grams^[1]
Motion axes: Up to 32 axes of motion^[1]
Tool bank: Thirteen-position tool bank with fast automatic tool change^[1]
Integration: SMEMA compatibility^[1]

Vintage & configurations

Control-system eraWindows^[1]

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Where are the manuals?

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Not publicly documented

Field notes

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Frequently asked questions

What bonding force and top-side heating does the MRSI 705HF provide?

The MRSI 705HF uses a heated bond head that can apply up to 500 N during bonding and can provide heating up to 400 °C from the top.^[1]^[2]^[3]^[8]

What material input formats can the MRSI 705HF pick from?

The MRSI 705HF can pick from any combination of Gel-Paks, waffle packs, wafers, and tape feeders. The MRSI 705HF can accommodate up to 90 waffle packs when using the Sector Plate Shuttle.^[1]^[2]^[9]

Not publicly documented

The following facts about the 705HF are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 705HF are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the 705HF are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
No publicly documented failure modes or field errata for the 705HF are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 705HF is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the 705HF are on record.
Answerable by: an OEM parts catalog or a service engineer

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Sources & citations

Sources (9)Every fact above is drawn from these public sources

[1]web.archive.org — web.archive.orgweb.archive.org
[2]MRSI Systems MRSI-705HF - High Force Die Bonder — mycronic.commycronic.com
[3]https://www.mycronic.com/globalassets/pdf/product-areas/die-bonding/brochures/mrsi-705hf-2-page-brochure-a4-2025.pdf — mycronic.commycronic.com
[4]Inventory photo
[5]Inventory photo
[6]Inventory photo
[7]Inventory photo
[8]MRSI-705HF High Force Die Bonder for power devices and advanced chip packaging — wwwint.mycronic.comwwwint.mycronic.com
[9]705HF — MRSI | Specs, Sourcing & Service | Waferpedia — waferpedia.comwaferpedia.com