MRSI H3TO

Models in this family

1. 

   H3TO

   The MRSI-H3TO is an MRSI-H family die bonder for handling multi-dies and multi-processes for complex TO products without tool changeover.

   Cited variants

   Designation	Generation	Vintage	Changes	Source
   MRSI-H-TO	—	—	Specifically designed for handling multi-dies and multi-processes for complex TO products without tool changeover; TO handling module combined with pick and place head for dual parallel processing; capability of both epoxy and eutectic die bonding in one process flow.	web.archive.org[1]
   MRSI-H-LD	—	—	Standard system widely used in advanced photonics such as lasers, receivers, transceivers, lighting, and sensors; includes a heated head option for higher density eutectic packaging and an on-the-fly patented auto tool changer with twelve vacuum tips/collets integrated on the bonding head for zero time tool change.	web.archive.org[1]
   MRSI-H-HPLD	—	—	Designed for bonding large high-power laser diodes in mass production; capable of die bonding single emitter and bar laser in different packages such as CoS, C-mount, and Bar-on-Submount (BoS); includes customized self-leveling tools for co-planarity solution.	web.archive.org[1]
   MRSI-H-LDMOS	—	—	Designed for bonding GaAs, Si, GaN, and SiC dies for RF Power Amplifiers and Microwave Applications in mass production; includes programmable die scrubbing for void-free bonding and inline heaters, conveyors, and loader/unloader options for improved UPH.	web.archive.org[1]

Sources