MRSI HVM1

Models in this family

1. 

   HVM1

   MRSI-HVM1 is a high-volume manufacturing flip-chip die bonder with 1 micron accuracy.

   Cited variants

   Designation	Generation	Vintage	Changes	Source
   MRSI-HVM1 with conveyor	—	—	Equipped with an inline conveyor for single fixture or multiple cassette inputs that can automatically transport large forms of carriers of the dies.	web.archive.org[1]
   MRSI-HVM1 heated head version	—	—	Includes a heated head on the right side while the left side has the same head as a typical MRSI-HVM1; localized top heating at a fixed temperature or with pulsed heating is described for eutectic bonding of multiple dies onto a common carrier.	web.archive.org[1]
   Heated head version	—	—	Includes a heated head on the right side while the left side has the same head as a typical MRSI-HVM1.	web.archive.org[1]

Sources