MRSI

HVM1

Research Quality: 40% complete

What is it?

The MRSI-HVM1 is described as an advanced ultra-precision solution for flexible volume production. It is a 1 micron accuracy flip-chip die bonder developed from the MRSI-HVM platform and is designed for Chip-on-Carrier, Chip-on-Submount, and Chip-on-Baseplate assembly using eutectic and/or epoxy stamping die bonding.

What can it run?

Process applications and technology nodes documented for this tool.

Chip-on-Carrier (CoC) assembly
Chip-on-Submount (CoS) assembly
Chip-on-Baseplate (CoB) assembly
Active Optical Cables (AOC)
chip-on-printed circuit board (PCB) applications
gold-box packaging

What do the numbers mean?

Wafer handling1

supported assembly types: Chip-on-Carrier (CoC), Chip-on-Submount (CoS), and Chip-on-Baseplate (CoB)^[1]

Performance1

accuracy: 1 micron level^[1]

Configuration & options4

machine type: flip-chip die bonder^[1]
application focus: high volume manufacturing^[1]
platform lineage: developed from the MRSI-HVM platform^[1]
process choices: eutectic, epoxy stamping, UV epoxy dispensing, and in-situ UV curing^[1]

Vintage & configurations

Documented models & variants

Designation	Generation	Vintage	Changes	Source
MRSI-HVM1 with conveyor	—	—	Equipped with an inline conveyor for single fixture or multiple cassette inputs that can automatically transport large forms of carriers of the dies.	web.archive.org^[1]
MRSI-HVM1 heated head version	—	—	Includes a heated head on the right side while the left side has the same head as a typical MRSI-HVM1; localized top heating at a fixed temperature or with pulsed heating is described for eutectic bonding of multiple dies onto a common carrier.	web.archive.org^[1]
Heated head version	—	—	Includes a heated head on the right side while the left side has the same head as a typical MRSI-HVM1.	web.archive.org^[1]

Interested in this tool?

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Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

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Not publicly documented

The following facts about the HVM1 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the HVM1 are on record.
Answerable by: OEM historical records or a trade-press announcement
The control-system platform and OS era of the HVM1 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the HVM1 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the HVM1 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the HVM1 are on record.
Answerable by: an OEM parts catalog or a service engineer

No research found yet — worked with this tool? Share what you know.

Sources & citations

Sources (3)Every fact above is drawn from these public sources

[1]web.archive.org — web.archive.orgweb.archive.org
[2]Sensors — web.archive.orgweb.archive.org
[3]MRSI Systems World Class Customer Support – Jack Inocencio — web.archive.orgweb.archive.org