MRSI HVM3

Models in this family

1. 

   HVM3produced 2018–

   MRSI-HVM3 is a high-precision die bonding platform for high-volume production, described by MRSI as a 3-micron class system.

   Cited variants

   Designation	Generation	Vintage	Changes	Source
   MRSI-HVM3	—	2019	The sources state that from 2019-10-01 shipment, the product name changed from MRSI-HVM3 to MRSI-H.	web.archive.org[1]
   MRSI-HVM3P	—	2018	Expanded the MRSI-HVM3 family with configurations for AOC, gold-box packaging, and other applications in addition to chip-on-carrier; equipped with inline conveyor for single fixture or multiple cassette inputs.	mycronic.com[2]

Sources