MRSI
HVM3
Produced
2018–
Vacuum
10 g to 5 kg per placement[4]
Performance
≤ 1 micron[4]
Gas delivery
Nitrogen, argon, N2-H2, or Ar-H2[4]
Optics
0.0045°[4]
What is it?
What can it run?
Process applications and technology nodes documented for this tool.
- Microwave modules
- Optical modules
- Epoxy die bonding
- Eutectic die bonding
- Microwave and RF devices
- MEMS
- Photonic / optical components
- High-power semiconductor packaging
What do the numbers mean?
Vacuum & pumping2
Wafer handling1
Gas & chemistry1
Optics & imaging5
Performance2
Control & software1
Configuration & options10
- Pickup nozzles
- 13 in standard nozzle changer; multiple changers optional; can also carry epoxy dispensing heads[4]
- Waffle packs
- Up to 72 2 x 2 in waffle packs (50.8 x 50.8 mm) or Gel-Paks™ or 4 x 4 in (101.6 x 101.6 mm)[4]
- Dispense needle cleaning
- Automated programmable cleaning between pattern dispense intervals[4]
Vintage & configurations
Documented models & variants
| Designation | Generation | Vintage | Changes | Source |
|---|---|---|---|---|
| MRSI-HVM3 | — | 2019 | The sources state that from 2019-10-01 shipment, the product name changed from MRSI-HVM3 to MRSI-H. | web.archive.org[1] |
| MRSI-HVM3P | — | 2018 | Expanded the MRSI-HVM3 family with configurations for AOC, gold-box packaging, and other applications in addition to chip-on-carrier; equipped with inline conveyor for single fixture or multiple cassette inputs. | mycronic.com[5] |
What replaced it?
Alternatives
Tools documented as functional equivalents — same process step and wafer size, from a different manufacturer. Each equivalence cites its source.
- ASM AD 838 L— Same function class: Packaging & Bonding, UnknownCompare in depthsource[6]
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Not publicly documented
The following facts about the HVM3 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
The control-system platform and OS era of the HVM3 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the HVM3 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the HVM3 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the HVM3 are on record.
Answerable by: an OEM parts catalog or a service engineer
No publicly hosted manuals, SOPs, or datasheets for the HVM3 are on record.
Answerable by: university cleanroom staff or an OEM application specialist
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (6)Every fact above is drawn from these public sources
- [1]web.archive.org — web.archive.orgweb.archive.org
- [2]mycronic.com — mycronic.commycronic.com
- [3]web.archive.org — web.archive.orgweb.archive.org
- [4]web.archive.org — web.archive.orgweb.archive.org
- [5]mycronic.com — mycronic.commycronic.com
- [6]Equipment inventory listing
Last updated Jul 29, 2026.
Compare with similar tools
View all →
Applied Materials model 0010-47763 is an ASSY ESC Bonded Monopolar Dual Heated unit.
The Applied Materials 0041-26723 is a bonded assembly used in semiconductor packaging and bonding applications.
