SUSS MicroTec SB 6 GEN 2

Models in this family

1. 

   SB 6 GEN 2

   The SUSS MicroTec SB 6 GEN 2 is a substrate bonder for substrate bonding processes. The SUSS MicroTec SB 6 GEN 2 handles standard size, semi spec wafers up to 150 mm in diameter and various shapes and types of materials.