SUSS MicroTec

The SUSS MicroTec PiXDRO LP 50 Inkjet is a desktop R&D inkjet printer for functional printing applications using PiXDRO technology.

The SUSS MicroTec MA 8 / BA 6 Wafer is a wafer aligner categorized under Lithography.

The SUSS SB 6 E is a semi-automatic substrate bonder designed for aligned and unaligned wafer, substrate, and chip bonding using thermo-compression, anodic, fusion, adhesive, and related technologies.

The SB8 Gen2 is part of SUSS MicroTec's high-precision bonding solutions, built on a scalable, modular platform for reliable permanent bonding outcomes.

The SUSS 80 T 3 is a spin coater.

The NIL-SFT8 Series is a compact table-top stamp fabrication tool for micro- and nanoimprint lithography.

The SUSS MicroTec MJB4 is a manual mask/wafer aligner for research and development that aligns and exposes wafers up to 4 inch (100 mm) diameter.

The SUSS MA 200 is a semi-automatic mask aligner capable of processing wafers up to 8 inches in diameter, using UV400 optics and a 365/405 nm sensor.

The LabSpin6 / 8 is a manual coating and developing system for substrates up to 200 mm, capable of spin coating and puddle developing.

The HP8, CP8, and VP8 are manual coating and developing systems from SUSS MicroTec, supporting wafers up to 200 mm and offering baking, cooling, and vapor priming capabilities.

The SUSS 150 e is a mask aligner manufactured by SUSS MicroTec.

The SUSS MicroTec AD12 is a manual system for aqueous developing and wafer cleaning, handling wafers up to 300 mm.

The MA / BA Gen4 Pro Series is a semi-automated mask aligner and bond aligner system supporting wafers up to 150 mm / 200 mm, with capabilities for exposure, UV bonding, fusion bonding, micro- and nanoimprinting, and selective plasma activation.

The MA100 / 150e Gen2 is an automated mask aligner for proximity exposure, supporting wafer sizes up to 150 mm.

The SUSS MicroTec DSC300 Gen2 is an automated full-field scanning projection lithography system for wafers up to 300 mm.

The SUSS Delta BM 20 is a coater.

The DSC500 is an automated, full-field scanning projection lithography system from SUSS MicroTec for substrates up to 450 x 500 mm.

The SUSS ACS 300 Gen 2 is a coater/developer system.

The SUSS SB 6 is a 6-inch wafer bonder with thermal compression and anodic bonding capabilities.

The SUSS XBS300 W2W is a wafer bonding system for permanent and temporary bonding applications.

The SUSS XBS200 is a permanent bonding system from SUSS MicroTec.

The SUSS MicroTec ABC 200 is an automated production wafer bonder for semiconductor manufacturing. The SUSS MicroTec ABC 200 handles 8-inch wafers.

The DSC300 Gen3 is a UV scanning mask alignment system from SUSS MicroTec.

The SUSS MicroTec Gamma 200 Spray is a spray coater for semiconductor manufacturing that applies photoresist and other coatings to wafers.

The SUSS MicroTec ELP300 Gen2 is an automated excimer laser processing system for substrates up to 300 mm, used for ablation, laser-assisted debonding, and seed layer removal.

The SUSS MJB 4 Mask Aligner is a mask aligner used for contact exposure and alignment, with source-stated support for wafers up to 4 inches in diameter.

The SUSS MicroTec Delta 12 AQ is an automated photoresist developer station that supports temperature controlled spray photoresist development.

The SUSS PA 200 is a semi-automatic wafer prober for precision semiconductor wafer testing and electrical measurement.

The ACS300 Gen3 is an automated coating and developing system for wafers up to 300 mm.

The SUSS Mask is a mask aligner used for photolithography.

The SUSS MA 6 Mask Aligner is a semiconductor lithography tool used for mask alignment and exposure, supporting various wafer sizes and featuring infrared alignment and a split-field microscope.

The SUSS MicroTec PA 200 HS Blueray is a test and probe tool. The PA 200 HS Blueray includes a control module, joystick, transformer, microscope, light source, XYZ prober Cascade Micro Positioner assemblies, probe arm and prober holder assemblies, and an isolation table.

The SUSS MJB 3 350 W is a mask aligner for 3-inch wafers.

The SUSS MicroTec NIL-SFT12 Series is an imaging solution for precise mask alignment.

SUSS MicroTec MS 100 is a tool model identified in a SUSS MicroTec MS 100 family entry.

The SUSS MA 4 Mask is a mask aligner used in lithography processes.

The SUSS AS 8 Spray Coater is a semi-automatic spray coater for substrates up to 200mm or 300mm in diameter and square substrates up to 6 inches edge length.

The SUSS RC 5 is a spin coater.

The SUSS MicroTec FC150 is a device bonder used in imprint processing and flip-chip bonding applications.

The SUSS MA 14 Mask Aligner is a mask aligner used in lithography for semiconductor manufacturing, MEMS R&D, and micro-nano structure fabrication.

The SUSS FC 150 is a flip chip bonder used for bonding semiconductor chips to substrates.

The SUSS MicroTec MA 12 is a semi-automated mask aligner for proximity exposure, supporting wafers up to 300 mm, with mask alignment and exposure capabilities.

The SUSS MicroTec DSM 200 Overlay Measurement is a double-sided overlay measurement system used for metrology and inspection on semiconductor wafers.

The SUSS MicroTec MA1006 is a manual mask aligner for top and bottom side alignment with exposure programmes for proximity, soft, hard and vacuum contact, suitable for wafers up to 150mm diameter.

The SUSS SB 8 E Wafer is a wafer bonder designed for 6-inch wafers, used in packaging and bonding applications.

The SUSS MA 150 E is a 6-inch (150 mm) automatic mask aligner configured with wafer thickness measurement and alignment accessories.

The SUSS MA 200 Automatic Mask Aligner is a lithography tool configured for top-side alignment and described as capable of working with wafer masks up to 9″ x 9″.

The SUSS RC 8 is a spin coater.

The SUSS MicroTec Delta 12 AQ Spin is an automated photoresist developer that supports temperature-controlled spray development and cassette-to-cassette substrate handling.

The SUSS MJB 3 Mask Aligner is a lithography system designed for 3-inch wafers, using a 350W Hg lamp and UV400 near UV optics with 0.6 µm resolution.

The SUSS MA 200 is a lithography aligner with source-listed wafer sizes of 6 inch and 8 inch.

The SUSS MicroTec ABC 200 Automated Production Wafer Bonder is an automated production wafer bonder for 8-inch wafers.

The SUSS MA 6 TSA Aligner is a single-side aligner with a BSA chuck, several mask holders and chucks, and no backside microscope.

The SUSS PL 12 is a wafer bonder manufactured by SUSS.

SUSS MicroTec Twin Gamma is a coater and developer for 4 inch and 6 inch wafers.

The SUSS Delta 80 Spin is a spin coater/developer with a 3 phase + N + PE, 400 V, 50 Hz power specification and no software included.

The SUSS MA 8 is a mask aligner used for photolithography, supporting 8-inch wafers with a full-spectrum lamp and optical sensors for 405 nm and 365 nm.