Waferpedia

Tool family

Toho Technology FLX-2320-S

Toho TechnologyMetrology & Inspection1 entry

The Toho Technology FLX-2320-S measures changes in wafer or substrate radius of curvature caused by deposition of a stressed thin film.

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Models in this family

  1. FLX-2320-S

    The Toho Technology FLX-2320-S measures changes in wafer or substrate radius of curvature caused by deposition of a stressed thin film.