Datacon

2200

Packaging & BondingIntroduced 1995Produced 1995–Datacon 2200 family

Research Quality: 40% complete

2200 — web.archive.org — Fig. 012200web.archive.org^[1]

Plate 01Besi Datacon 2200 evo and Datacon 8800 Series die bonder /die bonding machine
GEEKVALUE SMT SolutionsWatch on YouTube
Plate 02Datacon 2200 evo
GEEKVALUE SMT SolutionsWatch on YouTube
Plate 03Datacon 2200 Bonder (Wafer level die Bonding)
francis BoeyWatch on YouTube
Plate 04datacon 2200 evo besi 2200 evo series die bonder semiconductor equipment machine
GEEKVALUE SMT SolutionsWatch on YouTube
Plate 05datacon 2200 evo besi die bonder#semiconductorequipment #diebonder
GEEKVALUE SMT SolutionsWatch on YouTube
Plate 06Datacon 2200 EVO Demo Video
Ollie Dunne Tara SemiWatch on YouTube

What is it?

The Datacon 2200 apm Multi Chip Die Bonder is described as a modular system introduced in 1995 and developed for the advanced packaging market. The source states that it provides flexibility with minimum space requirements and supports flip chip, die attach, or combinations of both, with fast and simple conversion between applications.

What can it run?

Process applications and technology nodes documented for this tool.

Die Attach
Flip Chip
Hybrid/MCM
Optoelectronics
System in Package (SiP)
Stacked Die
Thin Die

What do the numbers mean?

Wafer handling1

Features & highlights: Automatic Tool Changer System; Automatic Wafer Handling System; Flip Chip Unit; Needle Ejector System; Processing of Epoxy, Flux and Solder Paste; Software Features & Options; Tape Feeder^[1]

Configuration & options6

Product type: Multi Chip Die Bonder^[1]
Platform basis: Based on Datacon's previous PPS 2200 Multi Chip Die Bonder platform^[1]
System description: Revolutionary modular system^[1]
Flexibility: Extraordinary flexibility with minimum space requirements^[1]
Application conversion: Conversion between different applications is done fast and simply^[1]
Developed for: Demanding advanced packaging market^[1]

Vintage & configurations

1995Production start^[1]
Datacon's previous PPS 2200 Multi Chip Die Bonder platform was introduced in 1995.

Documented models & variants

Designation	Generation	Vintage	Changes	Source
2200 apm+	—	—	—	web.archive.org^[1]

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Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

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Not publicly documented

The following facts about the 2200 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

The control-system platform and OS era of the 2200 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 2200 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 2200 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the 2200 are on record.
Answerable by: an OEM parts catalog or a service engineer
No publicly hosted manuals, SOPs, or datasheets for the 2200 are on record.
Answerable by: university cleanroom staff or an OEM application specialist