ADT
7500 Dicing
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
What it is
How it works
General reference — not yet source-verifiedA dicing saw separates semiconductor wafers or similar substrates into smaller pieces by cutting along scribe or street lines with a rotating blade or similar cutting tool. A grinding function in this class of equipment removes material by abrasive contact and is used to shape, thin, or finish workpieces.
Where it fits in the process flow
General reference — not yet source-verifiedA dicing saw sits in the back-end portion of semiconductor processing after wafer fabrication and before individual die are assembled or packaged. The machine supports singulation, which turns a processed wafer into separate chips for later handling.
A grinding function in this class is used when material removal or thickness reduction is needed before or after separation steps. The machine therefore belongs to the wafer singulation and finishing stage rather than front-end device fabrication.
What do the numbers mean?
Configuration & options5
- Parts Machine[1]
What replaced it?
Alternatives
Tools documented as functional equivalents — same process step and wafer size, from a different manufacturer. Each equivalence cites its source.
- Veeco ADS 800 Dicing— Same function class: Dicing & Grinding, UnknownCompare in depthsource[1]
- Disco DFD 6341 Automatic Dicing— Same function class: Dicing & Grinding, UnknownCompare in depthsource[1]
- Disco DAD 3221 Automatic Dicing— Same function class: Dicing & Grinding, UnknownCompare in depthsource[1]
- Disco DAD 3220 Automatic Dicing— Same function class: Dicing & Grinding, UnknownCompare in depthsource[1]
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
Not publicly documented
The following facts about the 7500 Dicing are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 7500 Dicing are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the 7500 Dicing are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the 7500 Dicing are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 7500 Dicing are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 7500 Dicing is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (2)Every fact above is drawn from these public sources
- [1]inventory listing
- [2]Equipment inventory listing
Last updated Aug 14, 2026.
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The Veeco ADS 800 Dicing System is a dicing system configured with a 220 VAC, 3-phase, 50/60 Hz, 30 Amp power requirement and includes motion, control, vision, and coolant delivery components.
The Disco DAD 3220 is an automatic dicing saw with source-stated configurations including a 1.5 kW spindle, a 1000 watt spindle, and a 40,000 min spindle revolutions specification.
