ASM
AD 896 Automatic
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
What it is
The ASM AD 896 is an automatic die bonder for semiconductor packaging.[1]
How it works
General reference — not yet source-verifiedAutomatic die bonders pick semiconductor dice from a wafer or tape and place them onto a substrate or leadframe with precise alignment and bond force.
The machine uses a collet or vacuum tool to lift each die and then applies pressure and often heat or adhesive to attach the die to the package.
Where it fits in the process flow
General reference — not yet source-verifiedDie bonding follows wafer dicing and precedes wire bonding or encapsulation in semiconductor packaging assembly.
The machine sits in the back-end packaging line after inspection and before the electrical interconnection step.
What do the numbers mean?
Configuration & options1
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Not publicly documented
The following facts about the AD 896 Automatic are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
Fewer than 3 independently cited specifications for the AD 896 Automatic are on record; the remainder await public documentation.
Answerable by: an OEM datasheet, a cleanroom equipment inventory, or an engineer who operated or installed it
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the AD 896 Automatic are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the AD 896 Automatic are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the AD 896 Automatic are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the AD 896 Automatic are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (1)Every fact above is drawn from these public sources
- [1]Equipment inventory listing
Last updated Sep 4, 2026.
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