ASM
Eagle 60 AP
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
ASM Eagle 60 AP is a wire bonder used in semiconductor packaging. ASM Eagle 60 AP units are available with 240 V single phase power at 50/60 Hz.[1][2][3][4]
What it is
General reference — not yet source-verifiedWire bonders are semiconductor packaging tools that create fine wire interconnections between a device and its package or substrate. Wire bonders are used after wafer processing and singulation, when electrical connections must be formed to complete device assembly.
How it works
General reference — not yet source-verifiedWire bonders generally position a semiconductor device or package under a bonding head and then form wire connections from bond pad to lead, substrate pad, or another interconnect point. Wire bonding commonly uses controlled force, motion, and bonding energy to create repeatable electrical and mechanical joints.
Where it fits in the process flow
General reference — not yet source-verifiedWire bonders sit in the assembly and packaging flow after die attach or equivalent package preparation and before encapsulation, lid attach, or final package completion. Wire bonding is a core interconnect step that links the semiconductor die to the outside world through the package structure.
Applications
General reference — not yet source-verifiedWire bonders are used for packaged semiconductor devices and related microelectronic assemblies that require wire interconnects from die pads to package terminals or substrate features. Wire bonding is common where mature packaging flows rely on direct metallic wire connections rather than area array interconnect methods.
What do the numbers mean?
Power & electrical6
Configuration & options5
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
Not publicly documented
The following facts about the Eagle 60 AP are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Eagle 60 AP are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the Eagle 60 AP are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the Eagle 60 AP are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the Eagle 60 AP are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the Eagle 60 AP is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (4)Every fact above is drawn from these public sources
- [1]Equipment inventory listing
- [2]Inventory photo
- [3]Equipment inventory listing
- [4]Inventory photo
Last updated Oct 18, 2026.
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