ASM
IS 9012 LA Automatic CIS Flip Chip
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
The ASM IS 9012 LA Automatic CIS Flip Chip Bonder is an automatic flip chip bonder designed for CIS packaging. The ASM IS 9012 LA was manufactured in 2010. The ASM IS 9012 LA requires a 220V power supply at 50/60 Hz.[1][2]
What it is
General reference — not yet source-verifiedFlip chip bonders are machines that attach semiconductor dies face-down onto substrates or packages by forming electrical interconnections directly from the die pads to substrate pads, typically using thermocompression, reflow, or adhesive bonding.
How it works
General reference — not yet source-verifiedIn operation, the bonder picks a die from a wafer or tape, aligns it to the substrate using vision systems that detect fiducials or die and substrate features, and then places the die precisely over the substrate pads.
Bonding force and heat are applied through a bonding tool to create a reliable electrical and mechanical joint, often through solder reflow, thermocompression, or adhesive curing.
Where it fits in the process flow
General reference — not yet source-verifiedUpstream process steps include wafer thinning, dicing, and die sorting. Downstream steps include underfill encapsulation, lid attach, and final package testing.
Applications
General reference — not yet source-verifiedCIS packages often require a transparent cover or lens assembly, and the bonder can accommodate the precision placement needed for such optoelectronic assemblies.
What do the numbers mean?
Power & electrical3
Configuration & options5
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
Not publicly documented
The following facts about the IS 9012 LA Automatic CIS Flip Chip are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the IS 9012 LA Automatic CIS Flip Chip are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the IS 9012 LA Automatic CIS Flip Chip are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the IS 9012 LA Automatic CIS Flip Chip are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the IS 9012 LA Automatic CIS Flip Chip are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the IS 9012 LA Automatic CIS Flip Chip is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (2)Every fact above is drawn from these public sources
- [1]Equipment inventory listing
- [2]Inventory photo
Last updated Aug 20, 2026.
Compare with similar tools
View all →
Applied Materials model 0010-47763 is an ASSY ESC Bonded Monopolar Dual Heated unit.
The Applied Materials 0041-26723 is a bonded assembly used in semiconductor packaging and bonding applications.
The Logitech 1 WBS 1 is a wafer substrate bonder for 6-inch wafers.
