Besi
2009 SSI E
The Besi / Datacon 2009 SSI E is a die bonder used in semiconductor packaging. The 2009 SSI E includes a Single Wafer Loader and Magazine to Magazine material handling. The 2009 SSI E supports SoftSolder Wire Dispense with OMP1, OMP780, and OMP1230 options.[1][2][3][4]
What it is
General reference — not yet source-verifiedDie bonders are packaging tools that place semiconductor die onto package substrates, leadframes, or other carriers with controlled alignment and bonding conditions. Die bonders are used after wafer fabrication and singulation to create assembled units that can proceed to later interconnect, encapsulation, and test steps.
How it works
General reference — not yet source-verifiedDie bonders generally pick individual die from a prepared wafer or other presentation format, align each die to a target site, and place the die onto a receiving carrier. Die bonders generally coordinate material presentation, placement motion, bonding force, and thermal or metallurgical process conditions to create the die attach.
Where it fits in the process flow
General reference — not yet source-verifiedDie attach tools sit in semiconductor assembly flow after wafer processing and die separation. Die attach tools feed downstream packaging operations by transferring die onto package components that can then move to interconnect formation, encapsulation, marking, singulation, and final electrical inspection.
Applications
General reference — not yet source-verifiedDie bonders are used where bare semiconductor die must be attached to a package element or other mounting surface before later interconnection and protection steps. Die bonders support packaging applications that depend on accurate die placement and a controlled attach process for electrical and thermal performance.
What do the numbers mean?
Wafer handling4
Configuration & options18
Vintage & configurations
Documented models & variants
| Designation | Generation | Vintage | Changes | Source |
|---|---|---|---|---|
| 2009 SSI E | — | 2014 | — | Equipment inventory listing[1] |
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
Not publicly documented
The following facts about the 2009 SSI E are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 2009 SSI E are on record.
Answerable by: OEM historical records or a trade-press announcement
The control-system platform and OS era of the 2009 SSI E are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 2009 SSI E are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 2009 SSI E is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the 2009 SSI E are on record.
Answerable by: an OEM parts catalog or a service engineer
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (4)Every fact above is drawn from these public sources
- [1]inventory listing
- [2]inventory listing
- [3]inventory listing
- [4]Equipment inventory listing
Last updated Oct 18, 2026.
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