2200 EVO Plus Die Bonder Hybrid

The Datacon 2200 EVO Plus Die Bonder Hybrid is a semiconductor die-attach (pick-and-place or die-bond) system manufactured by Besi (formerly Datacon).^[1][2][3][4]

Die bonders generally pick individual semiconductor die from a wafer (or from a tape-and-reel or waffle-pack carrier) using a precision collet or vacuum pickup tool, then place each die onto a substrate, leadframe, or package with controlled force, alignment, and position accuracy.

Hybrid die bonders integrate two or more bonding methods—such as epoxy dispensing, solder-paste printing, thermocompression, or ultrasonic bonding—so that the machine can handle different die-attach materials and process requirements without a tooling changeover.

In a semiconductor assembly flow, die bonding follows wafer dicing and precedes wire bonding, flip-chip underfill, encapsulation (molding), or other back-end packaging steps.

The machine sits upstream of wire bonders or flip-chip bonders: it attaches the die to the package substrate, after which electrical connections between the die pads and the substrate are made by wire bonding, tape-automated bonding (TAB), or solder bump reflow.

The Datacon 2200 EVO Plus Die Bonder Hybrid is used in advanced semiconductor packaging for applications such as multi-chip modules (MCMs), system-in-package (SiP) devices, memory stacks, RF modules, and power devices.

The hybrid capability supports processes with lead‑free solders, conductive adhesives (e.g., silver-filled epoxy), and eutectic alloys, covering a range of packaging requirements from consumer electronics to automotive and industrial applications.