Besi
2220 EVO
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
The Besi / Datacon 2220 EVO is a multi-chip die bonder with an accuracy of ±10 µm at 3 sigma.[1]
What it is
How it works
General reference — not yet source-verifiedDie bonders use a pick-and-place head to transfer dies from a supply source to a target substrate. Vision alignment systems locate the die and the target position to achieve high placement accuracy. Bonding may be performed using epoxy, solder, or eutectic methods depending on the process requirements.
Where it fits in the process flow
General reference — not yet source-verifiedIn semiconductor packaging, die bonding is performed after wafer dicing and before subsequent steps such as wire bonding, flip-chip attachment, or encapsulation. The die bonder receives singulated dies and places them onto leadframes, substrates, or package carriers. The assembled units then proceed to interconnect and encapsulation processes.
Applications
General reference — not yet source-verifiedMulti-chip die bonders are used in advanced packaging applications including system-in-package (SiP), multi-chip modules (MCM), and hybrid circuits. The machines handle a variety of die sizes and supply formats, enabling flexible integration of multiple components into a single package.
What do the numbers mean?
Wafer handling2
Performance1
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Not publicly documented
The following facts about the 2220 EVO are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 2220 EVO are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the 2220 EVO are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the 2220 EVO are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 2220 EVO are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 2220 EVO is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (2)Every fact above is drawn from these public sources
- [1]scanditron.com — scanditron.comscanditron.com
- [2]Equipment inventory listing
Last updated Sep 1, 2026.
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