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The DAG 810 uses anomalous in-feed grinding with wafer rotation. The machine uses a diamond wheel and a high-rigidity, low-vibration spindle to perform grinding.[2]
The DAG 810 includes a touch screen and graphical user interface for operation and on-screen status display. The machine supports in-feed grinding and creep-feed grinding as specified options or user-specified configurations.[2]
The DAG 810 is used for processing silicon and compound semiconductors for analysis. The machine is also used for resin, lithium tantalate, lithium niobate, green ceramics, and sapphire.[2]
The DAG 810 processes silicon and compound semiconductors for analysis. The machine also grinds resin for CSP and WL-CSP and improves the planarity of lithium tantalate and lithium niobate.[2]
The DAG 810 processes green ceramics and sapphire. The machine is also intended for a wide variety of electronic components and hard or brittle substrates.[2]
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
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The DAG810 supports Φ8 inch workpieces. The DAG810 also supports Φ4, 5, 6, and 8 inch workpieces when a universal chuck table is used.[2]
The DAG810 uses anomalous in-feed grinding with wafer rotation.[2]
The DAG810 uses a Φ200 mm diamond wheel. The DAG810 spindle has a rated torque of 5.7 N・m, a rated output of 4.2 kW, and a rotation speed range of 1,000 to 7,000 min−1.[2]
The DAG810 has equipment dimensions of 600 × 1,700 × 1,780 mm. The DAG810 has an approximate equipment weight of 1,300 kg.[2]
The following facts about the DAG 810 Ring Removal are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the DAG 810 Ring Removal are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the DAG 810 Ring Removal are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the DAG 810 Ring Removal are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the DAG 810 Ring Removal are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the DAG 810 Ring Removal is not on record.
Answerable by: an OEM datasheet or a fab qualification report
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Last updated Oct 16, 2026.
The ABM-407B-2-S-CE-S293 is a robot.