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DFD 6240 Fully Automatic Dicing

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DiscoDFD 6240 Fully Automatic Dicing

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Power

1.2 kW at 60,000 min⁻¹^[1]

Vacuum

0.5–0.8 MPa^[2]

Performance

Within 0.002/210 mm (single error)^[1]

Optics

0.00005 mm^[1]

Where it fits in the process flow

The DFD 6240 is used in the semiconductor back-end process for singulating individual die from a wafer after front-end processing and wafer thinning. The dicing step follows wafer grinding and polishing and precedes die attach and packaging. The machine is designed for dicing silicon wafers and compound semiconductor wafers, as well as for cutting and grooving ceramics, glasses, and other electronic and optical materials.^[3]

Applications

The DFD 6240 is applied to the dicing of silicon wafers and compound semiconductor wafers, including those made of gallium arsenide, silicon carbide, and other III-V materials. The machine is also used for cutting and grooving ceramics, glasses, and other electronic and optical materials that require high cutting loads. The optional high-power spindles (1.8 kW and 2.2 kW) enable processing of these harder materials. The machine's improved cut quality and throughput make it suitable for applications in semiconductor packaging, MEMS, LED manufacturing, and power device fabrication.^[1]^[3]^[2]

What do the numbers mean?

Power & electrical6

Spindle output (standard): 1.2 kW at 60,000 min⁻¹^[1]
Rated torque (1.2 kW spindle): 0.19 N·m^[1]
Revolution speed range (1.2 kW spindle): 6,000–60,000 min⁻¹^[1]
Spindle options: 1.8 kW (2 inch blades), 2.2 kW (3 inch blades)^[1]
Power consumption (processing): 1.5 kW (for reference)^[3]
Power consumption (warm-up): 1.0 kW (for reference)^[3]

Vacuum & pumping5

Air pressure: 0.5–0.8 MPa^[2]
Clean air pressure: 0.5–0.8 MPa^[2]
Cutting water / spinner cleaning water / water curtain pressure: 0.2–0.4 MPa^[2]
Cooling water pressure: 0.2–0.4 MPa^[2]
Exhaust duct capacity: 5.0 m³/min^[2]

Optics & imaging1

Z-axis moving resolution: 0.00005 mm^[1]

Performance2

Y-axis positioning accuracy: Within 0.002/210 mm (single error)^[1]
Z-axis repeatability accuracy: 0.001 mm^[1]

Dimensions & facilities3

Equipment dimensions (W×D×H): 900 mm × 1,190 mm × 1,800 mm^[1]
Equipment weight: Approx. 1,200 kg (without transformer) / approx. 1,280 kg (with transformer)^[1]
Cooling water consumption flow rate: 1.5 L/min at 0.3 MPa^[2]

Configuration & options13

Max workpiece size: Φ8 inch^[1]
X-axis cutting range: 210 mm^[1]
Cutting speed (X-axis): 0.1–1,000 mm/s (0.1–600 mm/s in source 3/6)^[1]
Y-axis cutting range: 210 mm^[1]
Y-axis index step: 0.0001 mm^[1]
Z-axis max stroke: 19.22 mm (for Φ2 inch blade) / 19.9 mm (for Φ3 inch blade)^[1]
Max blade size: Φ58 mm (or Φ2 inch/Φ3 inch blades depending on spindle option)^[1]
θ-axis max rotating angle: 380 deg^[1]
Applicable tape frame: 2-8-1^[2]
Average air consumption during operation: 110.0 L/min(ANR) (for reference)^[2]
Average clean air consumption during operation: 70.0 L/min(ANR) (for reference)^[2]
Max consumption flow rate (cutting water): 6 L/min^[2]
Max consumption flow rate (water curtain): 1 L/min^[2]

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What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

Spindle output (standard)1.2 kW at 60,000 min⁻¹^[1]
Rated torque (1.2 kW spindle)0.19 N·m^[1]
Revolution speed range (1.2 kW spindle)6,000–60,000 min⁻¹^[1]
Spindle options1.8 kW (2 inch blades), 2.2 kW (3 inch blades)^[1]
Power consumption (processing)1.5 kW (for reference)^[3]
Power consumption (warm-up)1.0 kW (for reference)^[3]
Air pressure0.5–0.8 MPa^[2]
Clean air pressure0.5–0.8 MPa^[2]
Cutting water / spinner cleaning water / water curtain pressure0.2–0.4 MPa^[2]
Cooling water pressure0.2–0.4 MPa^[2]
Exhaust duct capacity5.0 m³/min^[2]

Where are the manuals?

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Field notes

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Frequently asked questions

What spindle options are available for the DFD 6240?

The standard spindle is a 1.2 kW unit with a speed range of 6,000 to 60,000 min⁻¹. Optional spindles include a 1.8 kW spindle (compatible with 2-inch blades) and a 2.2 kW spindle (compatible with 3-inch blades).^[1]^[2]

What are the physical dimensions and weight of the DFD 6240?

The machine dimensions are 900 mm width, 1,190 mm depth, and 1,800 mm height. The weight is approximately 1,200 kg without an overseas transformer and approximately 1,280 kg with one.^[1]^[3]^[2]

What materials can the DFD 6240 process?

The DFD 6240 can process silicon and compound semiconductors, as well as ceramics, glasses, and other electronic and optical materials that require high cutting loads.^[1]^[3]

Not publicly documented

The following facts about the DFD 6240 Fully Automatic Dicing are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the DFD 6240 Fully Automatic Dicing are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the DFD 6240 Fully Automatic Dicing are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the DFD 6240 Fully Automatic Dicing are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the DFD 6240 Fully Automatic Dicing are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the DFD 6240 Fully Automatic Dicing is not on record.
Answerable by: an OEM datasheet or a fab qualification report