Disco
DFD 6341
The Disco DFD 6341 is a dicing saw (dicer) used for cutting wafers. The DFD 6341 requires a 3-phase electrical supply of 380-415 volts, 3 wires plus ground, at 50/60 Hz. Examples of the DFD 6341 were manufactured in 2016 and 2017.[1][2][3][4][5]
What it is
General reference — not yet source-verifiedDicing systems singulate semiconductor wafers or similar substrates by cutting along defined streets between devices. Dicing equipment belongs to the back end of device manufacturing, where finished or nearly finished wafers are separated into individual chips for later assembly and test.
How it works
General reference — not yet source-verifiedDicing systems typically move a mounted wafer under a rotating blade along programmed cut paths. Dicing systems generally rely on precise positioning, controlled spindle motion, and process water to support cutting and debris removal during singulation.
Where it fits in the process flow
General reference — not yet source-verifiedDicing follows wafer fabrication and wafer level processing, after the device pattern and interconnect structure are already in place. Dicing precedes die attach, packaging, and downstream electrical handling of individual chips.
Applications
General reference — not yet source-verifiedDicing equipment is used to separate completed devices formed across a wafer into individual dies. Dicing systems are applied where patterned substrates must be cut cleanly and repeatably before packaging or other downstream handling.
What do the numbers mean?
Power & electrical10
Configuration & options10
- 3 Wire + Ground[1]
What replaced it?
Alternatives
Tools documented as functional equivalents — same process step and wafer size, from a different manufacturer. Each equivalence cites its source.
- Veeco ADS 800 Dicing— Same function class: Dicing & Grinding, nullCompare in depthsource[6]
- Accretech SS 20 Automatic Dicing— Same function class: Dicing & Grinding, nullCompare in depthsource[6]
- ADT 8020 Auto Twin Dicing— Same function class: Dicing & Grinding, nullCompare in depthsource[6]
- Accretech AD 3000 T Dicing— Same function class: Dicing & Grinding, nullCompare in depthsource[6]
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
Not publicly documented
The following facts about the DFD 6341 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the DFD 6341 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the DFD 6341 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the DFD 6341 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the DFD 6341 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the DFD 6341 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (7)Every fact above is drawn from these public sources
- [1]Inventory photo
- [2]Inventory photo
- [3]Inventory photo
- [4]Inventory photo
- [5]Equipment inventory listing
- [6]DAD3360 | 切割机 | 产品信息 | DISCO CORPORATION — disco.co.jp (May 13, 2026)web.archive.org
- [7]Equipment inventory listing
Last updated Oct 20, 2026.
Compare with similar tools
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The ADT 8020 Auto Twin Dicing is a fully automatic twin dicing system for 8-inch workpieces.
The Accretech AD 3000 T Dicing is a fully automatic dicing saw for 300 mm wafers.
The Veeco ADS 800 Dicing System is a dicing system configured with a 220 VAC, 3-phase, 50/60 Hz, 30 Amp power requirement and includes motion, control, vision, and coolant delivery components.
Accretech SS20 is a semi-automatic dicing machine designed for wafer separation, supporting wafers up to 250 mm and square wafers.
