Disco
DFD 6361
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
What it is
General reference — not yet source-verifiedA dicing system singulates processed wafers into individual chips by cutting along the scribe lanes. A dicing and grinding system belongs near the back end of wafer processing, where wafers are thinned when needed and then separated into individual die for later assembly and packaging.
How it works
General reference — not yet source-verifiedDicing equipment typically holds a wafer on a support medium, aligns cut paths to the scribe pattern, and moves the wafer relative to a rotating blade while coolant and debris removal support the cut. Dicing and grinding platforms generally combine wafer thinning functions with singulation-related handling so that a wafer can be prepared and then cut in a controlled sequence.
Where it fits in the process flow
General reference — not yet source-verifiedDicing and grinding tools are used after front end device fabrication is complete and after the wafer has the layer stack and patterning needed for functional die. Dicing and grinding tools are positioned before die attach, packaging, and final test because singulated chips must be separated from the wafer before those downstream operations.
Applications
General reference — not yet source-verifiedDicing and grinding equipment is used where semiconductor wafers must be thinned and then separated into individual die. Dicing and grinding equipment supports production flows for packaged integrated circuits and other wafer based devices that require singulation before assembly.
What do the numbers mean?
Wafer handling1
Configuration & options4
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
Not publicly documented
The following facts about the DFD 6361 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the DFD 6361 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the DFD 6361 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the DFD 6361 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the DFD 6361 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the DFD 6361 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (2)Every fact above is drawn from these public sources
- [1]Equipment inventory listing
- [2]Equipment inventory listing
Last updated Oct 20, 2026.
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