DFD 651 Automatic Dicing

The Disco DFD 651 is a fully automatic dicing saw manufactured by Disco. The system supports wafer sizes of 6 inches and 8 inches. The DFD 651 includes features such as a dual 1000W synchro spindle, macro/micro automatic alignment, a high pressure spinner cleaning unit, non-contact setup, a broken blade detector, a motorized 360 degree theta stage, and a 12 inch monitor with camera. The machine is equipped with an 8 inch universal chuck table. Some units include a porous chuck. The system also incorporates a personal computer and monitor for control.^{[2][3][1][10]}

The DFD 651 employs a dual spindle configuration with 1000 watts per spindle. Automatic macro and micro alignment enables precise pattern recognition. A non-contact setup system reduces setup time. The high pressure spinner cleaning unit cleans the wafer after dicing. The broken blade detector monitors blade integrity. The motorized theta stage allows angular adjustment. The system is controlled via a 12 inch monitor with a camera interface.^[1][10]

The dicing saw is used in the back-end assembly process after wafer thinning, also known as grinding, and after the wafer is mounted on dicing tape. The singulated die are then picked and placed onto substrates or leadframes. Dicing is a critical step that separates functional dies from the wafer for subsequent packaging operations.