2008 XP

Die bonders are semiconductor packaging machines that place singulated die onto a package, substrate, leadframe, or other receiving part. Die bonding is a back-end assembly step that creates the mechanical and thermal attachment between the semiconductor die and its next-level carrier.

Die bonders generally pick individual die from prepared wafer or wafer-derived inputs, align each die to a target site, and place the die onto an adhesive or other attachment medium on the receiving part. Die bonders generally combine handling, vision-based alignment, placement motion, and process controls so that die are attached at the correct location and orientation.

Die bonding sits in semiconductor assembly after wafer fabrication and dicing, when individual chips must be attached into packages or onto substrates. Die bonding commonly precedes later assembly operations such as interconnection, encapsulation, sealing, and final test preparation.

Die bonders are used wherever semiconductor die must be attached to another structure for electrical packaging, thermal management, or mechanical support. Die bonding supports packaged integrated circuits, discrete devices, optoelectronic assemblies, sensor packages, and hybrid microelectronic builds.