Esec
2100 FC
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
The Esec 2100 FC hS is a flip chip die bonder. The Esec 2100 FC hS achieves a bonding accuracy of 8 µm at 3 sigma. The Esec 2100 FC hS supports wafer sizes from 4 to 12 inches.[1][2]
What it is
General reference — not yet source-verifiedFlip chip bonders are packaging tools that place singulated dies onto package substrates or carriers with the active side facing downward. Flip chip bonders are used in semiconductor assembly after wafer fabrication and singulation, where accurate die placement is needed before later interconnect completion and package finishing.
How it works
The Esec 2100 FC hS uses flip chip bonding. The Esec 2100 FC hS is specified with 8 µm bonding accuracy in high accuracy mode. The Esec 2100 FC hS is specified with a minimum cycle time of 240 ms including dip fluxing. The Esec 2100 FC hS includes real time process monitoring through 4 live images of the process zone. The Esec 2100 FC hS includes constant status control with real time wafer, strip, and magazine viewing. The Esec 2100 FC hS includes teach and setup wizards, parameter teach verification, and machine to machine recipe transfer.[1]
Where it fits in the process flow
The Esec 2100 FC hS supports wafer sizes from 4 inches to 12 inches. The Esec 2100 FC hS supports frame sizes of 6 inches, 8 inches, and 12 inches. The Esec 2100 FC hS supports strip dimensions up to 500 mm in length and 125 mm in width, with flat boats up to 137 mm in width. The Esec 2100 FC hS has available options for substrate handling, strip handling, magazine input and output, top stack loading, wafer mapping, and E142 strip mapping.[1]
Applications
The Esec 2100 FC hS is capable of running FCOL, FC-MIS, FC-SIP, FCCSP, FCBGA, and CSP-LED applications. The Esec 2100 FC hS supports die sizes from 0.2 mm to 20 mm. The Esec 2100 FC hS supports die thickness at or above 0.05 mm.[1]
Why won't it start?
Documented failure modes, common issues, and field considerations.
- Multiple missing parts are listed in the source.
- Missing parts: Output indexing clamp cable, Bond Z motor, Bond Z timing belt, Bond Z encoder, Bond Z encoder flat cable, Input pusher timing belt, Frame pusher Y direct motor, Hammer board, Bond head, Dispenser stepper motor X axis.
What do the numbers mean?
Wafer handling3
Performance1
Dimensions & facilities4
Configuration & options10
Vintage & configurations
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
Not publicly documented
The following facts about the 2100 FC are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 2100 FC are on record.
Answerable by: OEM historical records or a trade-press announcement
The control-system platform and OS era of the 2100 FC are not on record.
Answerable by: an engineer who operated it or OEM installation records
The process node or technology generation of the 2100 FC is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the 2100 FC are on record.
Answerable by: an OEM parts catalog or a service engineer
No publicly hosted manuals, SOPs, or datasheets for the 2100 FC are on record.
Answerable by: university cleanroom staff or an OEM application specialist
Sources & citations
Sources (6)Every fact above is drawn from these public sources
- [1]besi.com — besi.combesi.com
- [2]waferpedia.com — waferpedia.comwaferpedia.com
- [3]semiconductor.directory — semiconductor.directorysemiconductor.directory
- [4]micro-power.com.hk — micro-power.com.hkmicro-power.com.hk
- [5]Equipment inventory listing
- [6]2100 FC Flip Chip — Esec | Specs, Sourcing & Service | Waferpedia — waferpedia.comwaferpedia.com
Last updated Oct 16, 2026.
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