Waferpedia

Esec

2100 FC Flip Chip

Packaging & BondingEsec 2100 family
Research Quality: 30% complete
2100 FC Flip Chip — Inventory photo
Fig. 012100 FC Flip ChipInventory photo[1]

What is it?

The Esec 2100 FC is a flip chip bonder.

Why won't it start?

Documented failure modes, common issues, and field considerations.

  • Multiple missing parts are listed in the source.

What do the numbers mean?

Vacuum & pumping1

Solinoid valve vacuum[1]
Accurate?

Wafer handling8

Timing belt Y direction top stack loader[1]
Accurate?
Timing belt Y direction stack loader[1]
Accurate?
Timing belt Z direction stack loader[1]
Accurate?
Z motor stack loader[1]
Accurate?
Y motor top stack loader[1]
Accurate?
Y motor stack loader[1]
Accurate?
Stack loader Y direction pillow bearing[1]
Accurate?
Stack loader top pulley[1]
Accurate?

Configuration & options11

Missing parts:[1]
Accurate?
Output indexing clamp cable[1]
Accurate?
Bond Z motor[1]
Accurate?
Bond Z timing belt[1]
Accurate?
Bond Z encoder[1]
Accurate?
Bond Z encoder flat cable[1]
Accurate?
Input pusher timing belt[1]
Accurate?
Frame pusher Y direct motor[1]
Accurate?
Hammer board[1]
Accurate?
Bond head[1]
Accurate?
Dispenser stepper motor X axis[1]
Accurate?
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What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

  • ConfigurationSolinoid valve vacuum[1]

Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

No research found yet — worked with this tool? Share what you know.

Frequently asked questions

What is the Esec 2100 FC?

The Esec 2100 FC is a flip chip bonder.[1]

What model designation is given for this equipment?

The model designation is 2100 FC.[1]

Not publicly documented

The following facts about the 2100 FC Flip Chip are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 2100 FC Flip Chip are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • No publicly documented variants, configuration options, or revision breakpoints of the 2100 FC Flip Chip are on record.

    Answerable by: an OEM product catalog or an engineer who ordered or specified the tool

  • The control-system platform and OS era of the 2100 FC Flip Chip are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • The process node or technology generation of the 2100 FC Flip Chip is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

  • No publicly documented compatible parts, consumables, or accessories for the 2100 FC Flip Chip are on record.

    Answerable by: an OEM parts catalog or a service engineer

Sources & citations

Sources (1)Every fact above is drawn from these public sources
  1. [1]Inventory photo
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Last updated Jul 29, 2026.

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