Esec
2100 FC Flip Chip
The Esec 2100 FC Flip Chip is a flip chip bonder. The Esec 2100 FC Flip Chip uses flip chip bonding. The Esec 2100 FC Flip Chip is specified for wafers from 4" to 12".[1][2]
What is it?
Applications
Why won't it start?
Documented failure modes, common issues, and field considerations.
- Multiple missing parts are listed in the source.
What do the numbers mean?
Vacuum & pumping1
- Solinoid valve vacuum[3]
Wafer handling10
- Timing belt Y direction top stack loader[3]
- Timing belt Y direction stack loader[3]
- Timing belt Z direction stack loader[3]
- Z motor stack loader[3]
- Y motor top stack loader[3]
- Y motor stack loader[3]
- Stack loader Y direction pillow bearing[3]
- Stack loader top pulley[3]
Performance1
Dimensions & facilities3
Configuration & options17
- Missing parts:[3]
- Output indexing clamp cable[3]
- Bond Z motor[3]
- Bond Z timing belt[3]
- Bond Z encoder[3]
- Bond Z encoder flat cable[3]
- Input pusher timing belt[3]
- Frame pusher Y direct motor[3]
- Hammer board[3]
- Bond head[3]
- Dispenser stepper motor X axis[3]
Vintage & configurations
Documented models & variants
| Designation | Generation | Vintage | Changes | Source |
|---|---|---|---|---|
| Esec 2100 FC hS | 3rd generation | — | Described as the 3rd generation of the market leading High Speed FC platform. | besi.com[2] |
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
- ConfigurationSolinoid valve vacuum[3]
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
Not publicly documented
The following facts about the 2100 FC Flip Chip are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 2100 FC Flip Chip are on record.
Answerable by: OEM historical records or a trade-press announcement
The control-system platform and OS era of the 2100 FC Flip Chip are not on record.
Answerable by: an engineer who operated it or OEM installation records
The process node or technology generation of the 2100 FC Flip Chip is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the 2100 FC Flip Chip are on record.
Answerable by: an OEM parts catalog or a service engineer
No publicly hosted manuals, SOPs, or datasheets for the 2100 FC Flip Chip are on record.
Answerable by: university cleanroom staff or an OEM application specialist
Sources & citations
Sources (4)Every fact above is drawn from these public sources
- [1]2100 FC Flip Chip — Esec | Specs, Sourcing & Service | Waferpedia — waferpedia.comwaferpedia.com
- [2]besi.com — besi.combesi.com
- [3]Inventory photo
- [4]semiconductor.directorysemiconductor.directory
Last updated Oct 17, 2026.
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