DB 2100 FC HS

The Esec DB 2100 FC HS is a die bonder. The Esec DB 2100 FC HS is used in semiconductor packaging. The Esec DB 2100 FC HS belongs to the packaging and bonding equipment category.^[3][4]

Flip-chip bonders pick singulated die from a carrier and present the die to an alignment station. The alignment station uses vision to compare die features and substrate features before bonding. The bonder then places the die onto the substrate and applies bonding energy to form the interconnection. The bond head carries the die and controls its orientation during placement. The substrate stage holds the package substrate or lead frame under the bond head. Precision motion axes position the die over the bond site, and bond-force control governs the force applied during contact.

Flip-chip bonding sits in semiconductor assembly and packaging after wafer fabrication and wafer-level processing are complete. Upstream operations commonly include bump formation, inspection, and singulation. Downstream operations commonly include cleaning, underfill, and package encapsulation or molding.

Flip-chip bonders are used to attach singulated die onto package substrates or lead frames in semiconductor packaging flows. Machines in this class are used where accurate die-to-substrate alignment and controlled bonding are required. Flip-chip bonding can support bumped interconnect approaches such as solder bump, gold bump, and copper pillar processes.