Lithography

The EVG 101 is an advanced resist processing system for spin or spray coating and developing of wafers up to 300 mm.

The KLA FT-750 is a visible light spectrophotometer-based thin film measurement system for semiconductor process control.

The Laurell SU-8 is a spin station dedicated to applying SU-8 photoresist for lithography processes.

The SUSS MicroTec MA 8 / BA 6 Wafer is a wafer aligner categorized under Lithography.

The Nikon NSR 2205 i 11 D i-Line Stepper is a Nikon lithography stepper specified for 4-inch wafers.

The SUSS MicroTec MJB4 is a manual mask/wafer aligner for research and development that aligns and exposes wafers up to 4 inch (100 mm) diameter.

The Quintel Q 4000 Mask is a lithography mask aligner.

The EVG 150 is a modular cluster tool for coating and development of i-line photoresists.

The Nanoscribe Photonic Professional GT+ is a 3D nanoprinter for two-photon polymerization using an infrared 780 nm femtosecond laser.

The ASML Twinscan XT 1700 i Immersion Scanner is a 193nm immersion lithography system described as being used for volume chip production at 45nm mode.

The SUSS MA 200 is a semi-automatic mask aligner capable of processing wafers up to 8 inches in diameter, using UV400 optics and a 365/405 nm sensor.

The ASML PAS 5500/350C is a DUV stepper for photolithography, typically used in a cluster with a TEL Clean Track ACT-8 coater/developer for 100 mm wafers. The system dates from 1997.

The Nikon S 306 C is an 8-inch lithography scanner with ArF excimer laser exposure at 193 nm.

The ASML PAS 5500 275 i-Line is an i-line stepper for 8 inch wafers.

ASML PAS 5500 / 300 C is a DUV stepper described as a deep ultraviolet lithography system.

The ASML Twinscan NXT 1980 i is a 12-inch wafer lithography scanner that was upgraded from the 1970i model.

The SUSS 150 e is a mask aligner manufactured by SUSS MicroTec.

The Varian P/N: E 11003911 is a scanner assembly.

The MA / BA Gen4 Pro Series is a semi-automated mask aligner and bond aligner system supporting wafers up to 150 mm / 200 mm, with capabilities for exposure, UV bonding, fusion bonding, micro- and nanoimprinting, and selective plasma activation.

The Nikon NSR 2005 G 8 C is a G-line stepper introduced in 1991.

The ASML Twinscan XT 400 F is an i-line scanner for 300 mm wafers.

Applied Materials P 16 072 Ancolyzer is a lithography-related semiconductor equipment model described as an Ancolyzer system with dosage additive, slipstreams with pump, dosing VMS with bleed and feed, bulk fill tanks, additional doses of H2O2 and H2SO4, and scanner software.

The MA100 / 150e Gen2 is an automated mask aligner for proximity exposure, supporting wafer sizes up to 150 mm.

The ASML PAS 5500/400 is an i-line stepper for 8-inch wafers with a resolution of 280nm, introduced around 2002.

The Canon FPA 3030 i 5 + i-Line Stepper is a stepper used in photolithography for 6-inch wafers.

The Canon FPA 5510 iZ is an i-line stepper for 12-inch wafer processing.

The PAS 2500 series was the first lithography system developed entirely by ASML and became the system that built the company.

The Nikon 1505 G 7 E is a stepper used in lithography on 6-inch wafers with a 5-inch reticle.

The SUSS MicroTec DSC300 Gen2 is an automated full-field scanning projection lithography system for wafers up to 300 mm.

The Tokyo Electron CLEAN TRACK Lithius i+ is a 300 mm coater/developer track used for photoresist coating and developing and for spin-coating underlayer films in lithography processes.

The ASML TWINSCAN NXE:3400B is an extreme ultraviolet (EUV) lithography scanner designed for volume production at the 7 and 5 nm nodes.

The GCA 8500 is a commercial wafer stepper from GCA that performs 5x-reduction i-line photolithography, accepts 150 mm wafers, and resolves sub-micron features.

The DSC500 is an automated, full-field scanning projection lithography system from SUSS MicroTec for substrates up to 450 x 500 mm.

The Karl Suss MA6 is a high-resolution semi-automated photolithography mask aligner for research, development, and small-volume production.

The EVG 6200 Mask Aligner is a lithography tool configured for 6-inch and 8-inch wafers.

The Nikon NSR SF 140 i-Line is a stepper used for semiconductor lithography.

Heidelberg Instruments VPG200 is a laser pattern generator used for mask production, direct exposure on SEMI-standard wafers, and mask reticles.

The Canon FPA 2500 i 3 is a lithography stepper for 8-inch wafers.

The PAS 2400 is an early photolithography system from ASML that was demonstrated in 1985 and achieved a throughput of 90 wafers per hour.

The Ultratech AP 300 E is a stepper used in lithography.

The Hamatech HMR900 is a mask processor for Cr-plate wet processing or cleaning.

Canon FPA 5000 ES 3 is a lithography stepper identified with a Cymer ELS 6300 Laser and a Rasco BCU 900 Brine Chilling Unit.

Nikon NSR 2205 i 14 E 2 is an i-line stepper.

The DSC300 Gen3 is a UV scanning mask alignment system from SUSS MicroTec.

The SUSS MJB 4 Mask Aligner is a mask aligner used for contact exposure and alignment, with source-stated support for wafers up to 4 inches in diameter.

The Nikon NSR 2005 i 9 C i-Line Stepper is an i-line lithography stepper with source-stated configurations for 6-inch and 8-inch wafers.

The EVG 6200 NT is a mask alignment system for optical double-side lithography and wafer sizes up to 200 mm.

The Nikon NSR S 204 is a lithography scanner manufactured by Nikon that supports 8-inch wafers.

The SUSS MA 6 Mask Aligner is a semiconductor lithography tool used for mask alignment and exposure, supporting various wafer sizes and featuring infrared alignment and a split-field microscope.

The Nikon i 9 is a stepper manufactured by Nikon.

Brooks 017-0146-01 is a prealigner manufactured by Brooks.

The Ultratech XLS 7500 is an i-line stepper used for photolithography, capable of 0.50 µm resolution, and was ordered for manufacturing SAW and MEMS devices.

The OAI Model 30 is a UV exposure system.