Waferpedia

EV Group

810LT

low temperature plasma activation systemEV Group 810LT family
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810LT — epfl.ch
Fig. 01810LTepfl.ch[1]

  • Plate 01EVG 810LT Plasma Cleaner Demo

    Lithography Equipment SupportWatch on YouTube

What is it?

The EVG 810LT is listed as a plasma activation equipment used for low temperature plasma activation. The source states support for three process gases (O2, N2, or Ar), manual wafer loading and unloading, automated chamber closing and opening, and a location in Zone 6.

What do the numbers mean?

Wafer handling1

wafer loading/unloading
manual[1]
Accurate?

Gas & chemistry1

process gases
O2, N2, or Ar[1]
Accurate?

Configuration & options3

equipment type
low temperature plasma activation system[1]
Accurate?
chamber operation
automated chamber closing/opening[1]
Accurate?
location
Zone 6[1]
Accurate?
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What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

  • process gasesO2, N2, or Ar[1]

Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

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Frequently asked questions

What type of equipment is the EVG 810LT?

It is a low temperature plasma activation system.[1][2]

How are wafers handled on the EVG 810LT?

Wafer loading and unloading are manual, and chamber closing and opening are automated.[1][2]

Not publicly documented

The following facts about the 810LT are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 810LT are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • No publicly documented variants, configuration options, or revision breakpoints of the 810LT are on record.

    Answerable by: an OEM product catalog or an engineer who ordered or specified the tool

  • The control-system platform and OS era of the 810LT are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the 810LT are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

  • The process node or technology generation of the 810LT is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

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Sources & citations

Sources (3)Every fact above is drawn from these public sources
  1. [1]epfl.ch — epfl.chepfl.ch
  2. [2]Packaging – Miscellaneous ‒ Center of MicroNanoTechnology CMi ‐ EPFL — epfl.chepfl.ch
  3. [3]https://www.epfl.ch/research/facilities/cmi/wp-content/uploads/2024/08/EVG810_manual_2024.pdf — epfl.chepfl.ch
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Last updated Jul 29, 2026.