Heller

A reflow oven is thermal processing equipment used to heat assemblies according to a controlled temperature profile so solder paste can melt and then solidify into electrical and mechanical joints. Reflow ovens are commonly conveyorized systems used after paste deposition and component placement, and before downstream inspection, test, or subsequent assembly operations.
Reflow ovens move product through a sequence of heated sections and cooling sections while controlling time at temperature and heat transfer conditions. Reflow processing typically uses convection heating, and some systems can be configured for air or inert process atmospheres depending on product sensitivity and process goals.
Reflow ovens are used after solder paste printing or dispensing and after component placement. Reflow ovens are used before cleaning when required, optical inspection, x ray inspection, electrical test, conformal coating, or final assembly integration.
Reflow ovens can also appear in semiconductor packaging and advanced packaging lines where solder interconnect formation is part of the assembly flow. Thermal profile control in this part of the line affects wetting behavior, voiding behavior, joint shape, and thermal exposure of components and substrates.
Documented failure modes, common issues, and field considerations.
| Designation | Generation | Vintage | Changes | Source |
|---|---|---|---|---|
| 1913 MK III | — | — | — | Equipment inventory listing[5] |
| 1913 MK7 | — | — | — | hellerindustries.com[4] |
| 1913 MK7 Reflow Oven System | — | — | The MK7 line is described as an ISO-certified reflow oven with lower delta T on the board, reduced nitrogen consumption, extended product maintenance, a low-height package, nitrogen chamber air and vacuum options, and a green flux management system. | hellerindustries.com[4] |
Tools documented as functional equivalents — same process step and wafer size, from a different manufacturer. Each equivalence cites its source.
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
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The following facts about the 1913 MKIII are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 1913 MKIII are on record.
Answerable by: OEM historical records or a trade-press announcement
The control-system platform and OS era of the 1913 MKIII are not on record.
Answerable by: an engineer who operated it or OEM installation records
The process node or technology generation of the 1913 MKIII is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the 1913 MKIII are on record.
Answerable by: an OEM parts catalog or a service engineer
No publicly hosted manuals, SOPs, or datasheets for the 1913 MKIII are on record.
Answerable by: university cleanroom staff or an OEM application specialist
Last updated Oct 16, 2026.
The ERSA Hotflow 3/20 is a reflow soldering machine designed for SMT board assembly, featuring patented heating technology for efficient heat transfer and low energy and nitrogen consumption.
The BTU Pyramax 125A is a lead-free SMT reflow oven with 10 heated zones and a maximum operating temperature of 350°C.
The BTU Pyramax 98 is a forced convection lead-free reflow oven with up to 7 heated zones and a 350°C maximum operating temperature.
The Vitronics Soltec XPM 3 1030 is a reflow oven described as operating with 400 V, 3 phase, 50 Hz power and AIR atmosphere.