Thermal / Diffusion

The CEE Apogee 300 Bake Plate is a semiconductor wafer bake plate for up to 300mm wafers with recipe-controlled thermal processing and DataStream™ logging.

The Tokyo Electron A 8 S ZA is a PoCl3 furnace with an EPROM based control system.

The YES 12-2P-CP is a manual-load high-temperature cure oven for MEMS and semiconductor process applications.

The Despatch LCD1-16NV-3 is an oven for polymer curing with nitrogen circulation, a HEPA filter, and temperature monitoring capability.

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The BTU Pyramax 98 is a forced convection lead-free reflow oven with up to 7 heated zones and a 350°C maximum operating temperature.

The Tenney Thermal Shock Jr Thermal Shock Chamber is a thermal shock chamber with an 11" L × 5.5" W × 5" H basket and a temperature range of -70 °C to +200 °C.

The Lindberg/Blue M Tube Furnace is a family of laboratory tube furnaces including the Mini-Mite series (models TF55030A, TF55030C, etc.) with a maximum temperature of 1100°C and the STF55433 model rated for 1500°C.

The Blue M OV 500 C 2 is an oven.

The Brewer Science 11 Bake Plate is a thermal processing bake plate for large-area substrates and FPD/LCD panels. The Brewer Science 11 Bake Plate emphasizes thermal accuracy and uniformity.

The Heller 1088 is a forced-convection SMT reflow oven designed for medium- to high-volume PCB assembly.

Model 1518 is a dual-function ultra-clean system for HMDS prime and image reversal with stated capacities for 4-inch through 8-inch wafer cassettes.

The Palomar 1200 is a eutectic die attach oven.

The Blue M DCC 256 E MP 750 Clean Room Oven is a clean room oven. The Blue M DCC 256 E MP 750 Clean Room Oven has a maximum temperature of 250°C and electrical requirements of 208 V, 3 Ph, 60 Hz, and 27 A.

The Heller 1705 EXL is a reflow oven.

The Blue M IGF 6680 F 4 is a gas oven with a digital programmable controller, an overtemperature controller, inert gas input, and a maximum temperature of 593°C.

The Axcelis Fusion M 200 PC is a UV cure system for semiconductor wafer processing.

The Lindberg / Blue M GO 1300 A Gravity Oven is a convection oven with a temperature range of 40°C to 200°C.

The Blue M 0 500 is an oven manufactured by Blue M, with asset number 139866.

The Varian VHS 250 is a diffusion pump used for high vacuum applications.

The YES PBX4-300 is a fully automated 300mm and 200mm polyimide/BCB/copper anneal and vacuum bake system from Yield Engineering Systems.

The Heller 1809 MK III SMT is a reflow oven for SMT soldering applications.

The Hitachi Kokusai DD 812 V is a diffusion system designed for N2 anneal processing of 6-inch wafers.

The Despatch LAD 1 42 is an oven described as a brown oven with 400C high temperature, N2 overflow, 425C maximum, and a note that it needs a breaker.

The Tokyo Electron Alpha 8 S is a vertical furnace for 8-inch wafers, configured for ATM Oxide processes.

The Blue M IGF 6680 F is an inert gas cure oven.

The Axcelis Fusion M 200 PCU UV Cure System is a UV cure system designed for 8-inch wafers.

The Tokyo Electron Alpha 8 SE Z is an oxidation furnace configured for 8-inch wafers.

The Thermo Fisher Scientific Precision 29 is a thermal/diffusion oven.

The SUSS ACS 300 Gen 2 is a coater/developer system.

The Heller 1809 MK III is a reflow oven.

Applied Materials Producer GT 3 RTP is a rapid thermal process system for 12-inch wafers.

The Herareus UT 6120 Drying is a drying oven manufactured by Thermo Scientific / Herareus (Thermo Fisher) and categorized under Thermal / Diffusion.

The ASM A 400 Furnace is an 8-inch furnace configured for poly/nitride processing.

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The Tokyo Electron Alpha 303 i K is a 12-inch-wafer furnace in the Thermal / Diffusion category, documented in MTO and DCS-MTO configurations.

The Tokyo Electron Alpha 801 D vertical furnace processes 8-inch wafers and is configured for atmospheric oxide deposition.

The Canon BCOS V is an in-line curing oven.

The YES PB12 is a PB-HV Series manual-load high vacuum oven, stated to support up to 300 mm wafers and to be designed for MEMS and semiconductor process applications.

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Thermco MB 80 Mini Brute Diffusion Furnace is a 6.5 bore, 3-zone, open-on-both-sides furnace rated to 1200°C.

The Yes 450 PB 8-2 P-CP Polyimide Bake Oven is a polyimide bake oven with a 208 Vac, 3 phase, 60 Hz power specification.

Tokyo Electron Formula is a furnace with source-listed 12-inch wafer size and applications including TEOS, HF, F2, DCS, NH3, and SiN.

The SVG Thermco 5204 Diffusion Furnace is a thermal diffusion system for 150 mm (6 inch) wafers with a 40 inch flat zone.

The Heller 1707 MK 5 is a reflow oven, also described as an oven, with a 400 V supply that can convert to 220 V.

The Tokyo Electron Formula Diffusion is a diffusion furnace for thermal processing, with a variant supporting 300 mm wafers and an aluminium oxide process.

The Blue M 1200 C Box Furnace is a programmable high-temperature box furnace used for thermal processing of wafers and samples in a laboratory cleanroom environment.

The YES 310TA is a vacuum cure and HMDS vapor prime oven used for batch priming of wafers to improve photoresist adhesion.

The Veeco LSA101 is a Laser Spike Annealing System used for precision doping of materials at a controlled temperature in semiconductor manufacturing.

The Yes 450 PB 8-4 is an oven.

The Thermotron SE 600 13 13 is a temperature chamber with a 20.7 ft³ workspace volume.

The Blue M POM 323 GXX is an oven used in semiconductor manufacturing.