Thermal / Diffusion

The Samsung Galaxy S 4G is a smartphone released in February 2011 with a 4.0-inch Super AMOLED display, 1 GHz Hummingbird processor, and 5 MP camera.

The BTU Pyramax 98 is a forced convection lead-free reflow oven with up to 7 heated zones and a 350°C maximum operating temperature.

The Thermo Fisher Scientific MO 1490 A 1 is a Mechanical Oven.

The Heller 1088 is a forced-convection SMT reflow oven designed for medium- to high-volume PCB assembly.

The Palomar 1200 is a eutectic die attach oven.

The Lindberg/Blue M Tube Furnace is a family of laboratory tube furnaces including the Mini-Mite series (models TF55030A, TF55030C, etc.) with a maximum temperature of 1100°C and the STF55433 model rated for 1500°C.

The Rehm RDS 6000 is a UV curing oven used for industrial drying and hardening processes, particularly in PCB manufacturing, with vintages reported in 2022 and 2023.

The Axcelis Fusion M 200 PC is a UV cure system for semiconductor wafer processing.

The Lindberg / Blue M GO 1300 A Gravity Oven is a convection oven with a temperature range of 40°C to 200°C.

The Varian VHS 250 is a diffusion pump used for high vacuum applications.

The Tokyo Electron Alpha 8 S ZC is a furnace for 8-inch wafers used for nitride processing.

The Heller 1809 MK III SMT is a reflow oven for SMT soldering applications.

The Hitachi Kokusai DD 812 V is a diffusion system designed for N2 anneal processing of 6-inch wafers.

The Tokyo Electron Alpha 8 S is a vertical furnace for 8-inch wafers, configured for ATM Oxide processes.

The Blue M 1200 C Box Furnace is a programmable high-temperature box furnace used for thermal processing of wafers and samples in a laboratory cleanroom environment.

The Blue M MO 1440 A 1 is a reliability oven manufactured by Blue M.

The Heller 1809 EXL is a forced convection reflow oven for soldering surface-mount components, featuring 9 top and 9 bottom heating zones, dual-zone active cooling, and temperature control accuracy of ±0.1°C, capable of handling board widths up to 23.5 inches.

The Blue M WSP 109 C MP 3 is a hot and cold oven.

The Heller 1913 MKIII is a reflow oven used for soldering electronic components onto printed circuit boards.

The Yes 450 PB 12 Polyimide Bake Oven is a batch process bake oven with capacity for two 25-wafer cassettes and 300mm FOUPs.

The YES 15 HMDS Vapor Prime Oven is a vacuum oven used for HMDS vapor priming to improve photoresist adhesion on wafers.

The YES 310TA is a vacuum cure and HMDS vapor prime oven used for batch priming of wafers to improve photoresist adhesion.

YES-6112 is an ultra-clean Vacuum Bake/Vapor Prime system for 8-inch wafers.

The Yes 450 PB 8-2 P-CP Vacuum Oven is a stand-alone vacuum oven for 4, 5, 6, and 8 inch wafers.