Hitachi
CM 700 H
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
What it is
The Hitachi CM 700 H is a die bonder used in semiconductor packaging and bonding.[1]
How it works
General reference — not yet source-verifiedA die bonder places a semiconductor die onto a prepared site and bonds it to the package or substrate with controlled positioning and attachment steps.
A die bonder class machine typically uses precision motion, vision alignment, and bonding controls to handle small parts with repeatable placement.
Where it fits in the process flow
General reference — not yet source-verifiedA die bonder sits in the packaging flow after die preparation and before later assembly steps that complete the package.
A die bonder supports assembly operations that follow device singulation and precede encapsulation or other final package-forming steps.
Applications
General reference — not yet source-verifiedDie bonders are used for semiconductor assembly tasks that attach chips to packages, carriers, or substrates.
Die bonders are used in packaging and bonding work where precise die placement and attachment are required.
What do the numbers mean?
Power & electrical2
- 50/60 Hz[1]
Configuration & options3
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What is the Hitachi CM 700 H?
The Hitachi CM 700 H is a die bonder used in semiconductor packaging and bonding.[1]
Not publicly documented
The following facts about the CM 700 H are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the CM 700 H are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the CM 700 H are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the CM 700 H are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the CM 700 H are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the CM 700 H is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (1)Every fact above is drawn from these public sources
- [1]Inventory photo
Last updated Oct 12, 2026.
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