Waferpedia

Karl Suss

SB8

Backend6"Karl Suss SB8 family
Research Quality: 40% complete
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SB8 — nanolab.ucla.edu
Fig. 01SB8nanolab.ucla.edu[2]

Wafer size

6"

Power

up to 2000 V[1]

Vacuum

5e-5 to 3e3 Torr with nitrogen[1]

Performance

+/- 5 degrees[1]

Control era

Windows-based

What is it?

The Karl Suss SB8 Wafer Bonder is listed in the Backend equipment category. The source states that it can perform silicon fusion, anodic, and eutectic bonding, supports wafer bonding from 50°C to 550°C with pieces up to 6" wafers, and is configured for manual loading with Windows-based computer control.

What can it run?

Process applications and technology nodes documented for this tool.

  • silicon fusion bonding
  • anodic bonding
  • eutectic bonding
  • thermal compression bonding
  • aligned bonding

What do the numbers mean?

Power & electrical1

Anodic bonding voltage
up to 2000 V[1]
Accurate?

Vacuum & pumping1

Bonding pressure environment
5e-5 to 3e3 Torr with nitrogen[1]
Accurate?

Wafer handling3

Force capability
up to 20 kN for a 150 mm wafer size[1]
Accurate?
Sample size
pieces to 6" wafers[1]
Accurate?
Loading
manual loading of wafers[1]
Accurate?

Performance2

Temperature accuracy
+/- 5 degrees[1]
Accurate?
Temperature uniformity
+/- 3% uniformity[1]
Accurate?

Control & software1

Control
Windows-based computer control[1]
Accurate?

Configuration & options4

Bonding types
silicon fusion, anodic, and eutectic bonding[1]
Accurate?
Temperature range
50°C to 550°C[1]
Accurate?
Heated samples
upper and lower heating of samples[1]
Accurate?
Aligned bonding
mates with the Karl-Suss MA-6 aligner for aligned bonding[1]
Accurate?

Vintage & configurations

Control-system eraWindows-based[1]

Interested in this tool?
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What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

  • Bonding pressure environment5e-5 to 3e3 Torr with nitrogen[1]
  • Anodic bonding voltageup to 2000 V[1]

Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

No research found yet — worked with this tool? Share what you know.

Not publicly documented

The following facts about the SB8 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the SB8 are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • No publicly documented variants, configuration options, or revision breakpoints of the SB8 are on record.

    Answerable by: an OEM product catalog or an engineer who ordered or specified the tool

  • No publicly documented failure modes or field errata for the SB8 are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

  • The process node or technology generation of the SB8 is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

  • No publicly documented compatible parts, consumables, or accessories for the SB8 are on record.

    Answerable by: an OEM parts catalog or a service engineer

No research found yet — worked with this tool? Share what you know.

Sources & citations

Sources (5)Every fact above is drawn from these public sources
  1. [1]nanolab.ucla.edu — nanolab.ucla.edunanolab.ucla.edu
  2. [2]nanolab.ucla.edu — nanolab.ucla.edunanolab.ucla.edu
  3. [3]Equipment | UCLA Nanolab — nanolab.ucla.edunanolab.ucla.edu
  4. [4]SB8 Gen2 | SUSS — suss.comsuss.com
  5. [5]SB8 Gen2 | SUSS — suss.comsuss.com
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Last updated Jul 29, 2026.