6"

The KLA Flexus F 2320 I is a stress measurement system for semiconductor wafers that supports 6-inch and 8-inch wafers and uses dual wavelength measurement.

The Varian CC2 is a vacuum gauge controller that is part of the Denton Discovery 18 sputter deposition system.

The Oxford PRS900 is a computer-driven barrel reactor dedicated to dry resist stripping.

The AJA ATC 2200 is a UHV sputtering system used for physical vapor deposition of films on substrates.

The Dektak 6M is a stylus profilometer used for film step-height measurement, surface topography profiling, and surface roughness measurement.

The Kulicke & Soffa 782-6 is a dicing saw that handles wafers up to 6 inches and up to 800 µm thick, and dices Si, Glass, Quartz, SiC, Sapphire, and LiNbO3 with kerf widths down to 50 µm.

The Lam AutoEtch 490 is an in-line, cassette to cassette, fully automated, single wafer, double air-locked, parallel plate plasma etching system.

Heidelberg Instruments DWL66 is a high-resolution direct write pattern generator for direct writing on various substrates and mask making.

The Zeiss SEM Crossbeam 550 is a scanning electron microscope configured at CMi for imaging dedicated to process control and supported with metrology and analysis software.

The CEE 100 is a lithography spin coater/developer tool that accepts up to 6-inch wafers and supports programmable multi-step processing.

The Malvern Panalytical X'Pert 3 MRD XL is an XRD (X-ray Diffractometer) with listed wafer holders for 6 inch and 300 mm wafers.

The Karl Suss SB8 Wafer Bonder supports silicon fusion, anodic, and eutectic bonding.

The Filmetrics F10-RT is an optical spectrometer used for reflectivity measurements.

The Lam AutoEtch 590 is an in-line cassette to cassette, fully automated, single wafer, double air-locked, parallel plate plasma etching system.

The Signatone S-460 is a 6-inch semi-automatic probe station with automated wafer stepping, motorized theta, and a quick two-point align feature.

The OAI 806 Mask Aligner is a precision photolithography tool for patterning substrates up to 6 inches with soft, hard, and proximity contact modes.

Raith EBPG5200 is a direct write electron beam lithography system with high-kV capability and automation features stated in the product page for the EBPG line.

The Axcelis NV GSD HE Ion is an ion implantation system. The Axcelis NV GSD HE Ion supports wafer handling for 6-inch and 8-inch wafers.

The MPI TS150 Probe Station is designed for electrical testing on wafers or chips and supports wafers up to 6 inch.

The MPI TS150 Probe Station is an electrical test probe station for wafers or chips, using MPI PM100 true X,Y,Z micro-positioners for probe mounting.

Nikon NSR 2205 i 8 A i-Line Stepper is a 6-inch wafer lithography stepper with a listed 0.5 µm resolution.

The SCREEN / DNS SU 2000 is a single-wafer wet etch tool available in both acid and solvent configurations, supporting 6-inch and 8-inch wafers.