6"

The Varian CC2 is a vacuum gauge controller that is part of the Denton Discovery 18 sputter deposition system.

The Oxford PRS900 is a computer-driven barrel reactor dedicated to dry resist stripping.

Raith EBPG5200 is a direct write electron beam lithography system with high-kV capability and automation features stated in the product page for the EBPG line.

The MPI TS150 Probe Station is designed for electrical testing on wafers or chips and supports wafers up to 6 inch.

The Dektak 6M is a stylus profilometer used for film step-height measurement, surface topography profiling, and surface roughness measurement.

The KLA Flexus F 2320 I is a stress measurement system for semiconductor wafers that supports 6-inch and 8-inch wafers and uses dual wavelength measurement.

The AJA ATC 2200 is a UHV sputtering system used for physical vapor deposition of films on substrates.

The CEE 100 is a lithography spin coater/developer tool that accepts up to 6-inch wafers and supports programmable multi-step processing.

The Karl Suss SB8 Wafer Bonder supports silicon fusion, anodic, and eutectic bonding.

Nikon NSR 2205 i 8 A i-Line Stepper is a 6-inch wafer lithography stepper with a listed 0.5 µm resolution.

The Signatone S-460 is a 6-inch semi-automatic probe station with automated wafer stepping, motorized theta, and a quick two-point align feature.

The OAI 806 Mask Aligner is a precision photolithography tool for patterning substrates up to 6 inches with soft, hard, and proximity contact modes.

The MPI TS150 Probe Station is an electrical test probe station for wafers or chips, using MPI PM100 true X,Y,Z micro-positioners for probe mounting.

Heidelberg Instruments DWL66 is a high-resolution direct write pattern generator for direct writing on various substrates and mask making.