7500 Wafer

The Kulicke & Soffa 7500 Wafer is a wafer dicing saw. The Kulicke & Soffa 7500 Wafer is categorized under dicing and grinding. The Kulicke & Soffa 7500 Wafer is used for precision cutting.^[4][2][1][3]

Wafer dicing saws separate a processed wafer into individual dies by cutting along scribe streets. Wafer dicing saws generally hold the wafer on adhesive film or a chuck while a rotating blade cuts through the wafer. Wafer dicing saws commonly use coolant to limit heating and to remove debris from the cut. Wafer dicing is a singulation step rather than a front end patterning step.

Wafer dicing saws are back end tools used after wafer fabrication and after the wafer is ready for singulation. Wafer dicing saws typically receive wafers that have already completed device formation and most wafer level processing. Wafer dicing saws feed downstream assembly and packaging operations, where separated dies are picked from tape and placed into package flows.

Wafer dicing saws are used to singulate semiconductor devices from processed wafers. Wafer dicing saws are applied to device types such as memory, logic, analog, power devices, discrete components, and sensors. Wafer dicing saws can be used on common semiconductor wafer materials including silicon and compound semiconductor substrates.