Kulicke & Soffa

782-6

Dicing & Grinding 6"Kulicke & Soffa 782-6 family

Research Quality: 40% complete

782-6 — nanofab.ece.cmu.edu — Fig. 01782-6nanofab.ece.cmu.edu^[1]

What is it?

The Kulicke & Soffa 782-6 Dicing Saw is identified in the source as a dicing saw used in back-end and post-processing. The listed specifications say it handles up to 6-inch wafers, supports wafers up to 800 µm thick, dices Si, Glass, Quartz, SiC, Sapphire, and LiNbO3, and has a kerf width down to 50 µm with blade-dependent performance. DI water blade cooling and rinsing is also stated.

What can it run?

Process applications and technology nodes documented for this tool.

Back end and post processing
Dicing

What do the numbers mean?

Wafer handling2

Maximum wafer size: up to 6" wafers^[1]
Maximum wafer thickness: 800 µm thick^[1]

Dimensions & facilities1

Kerf width: down to 50 µm (blade dependent)^[1]

Configuration & options2

Materials diced: Si, Glass, Quartz, SiC, Sapphire, LiNbO3^[1]
Blade cooling and rinsing: DI water^[1]

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Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

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Not publicly documented

The following facts about the 782-6 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 782-6 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the 782-6 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the 782-6 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 782-6 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 782-6 is not on record.
Answerable by: an OEM datasheet or a fab qualification report

No research found yet — worked with this tool? Share what you know.

Sources & citations

Sources (2)Every fact above is drawn from these public sources

[1]nanofab.ece.cmu.edu — nanofab.ece.cmu.edunanofab.ece.cmu.edu
[2]Equipment - Claire & John Bertucci Nanotechnology Laboratory - College of Engineering - Carnegie Mellon University — nanofab.ece.cmu.edunanofab.ece.cmu.edu