Kulicke & Soffa

A dicing saw separates processed wafers into individual chips by moving a rotating blade through predefined cut streets. Dicing saws generally combine wafer mounting, alignment, spindle motion, and controlled feed motion so the blade can cut the substrate while limiting damage to adjacent die.
Dicing equipment is used late in semiconductor manufacturing after wafer fabrication and after any needed backgrinding or thinning steps. Dicing equipment prepares singulated die for subsequent handling steps such as inspection, sorting, packaging, or assembly.
Dicing saws are used to singulate semiconductor wafers into individual die for device manufacturing. Dicing saws are also used on other wafer-like substrates and packaged substrate forms when precision cut separation is required.
Tools documented as functional equivalents — same process step and wafer size, from a different manufacturer. Each equivalence cites its source.
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
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The Kulicke & Soffa 984 6 Dicing is specified for 50/60 Hz operation.[1][3][5]
The Kulicke & Soffa 984 6 Dicing is specified for 208 VAC line voltage.[1][3][5]
The following facts about the 984 6 Dicing are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 984 6 Dicing are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the 984 6 Dicing are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the 984 6 Dicing are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 984 6 Dicing are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 984 6 Dicing is not on record.
Answerable by: an OEM datasheet or a fab qualification report
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Last updated Oct 17, 2026.
The Disco DAG 810 is an automatic grinder for semiconductor wafer processing, offering a spindle rated at 4.2 kW, torque 5.9 N·m, and speed range 1,000 to 7,000 min⁻¹.
The Lapmaster Model 15 is a bench-mounted unit with a rigid, lightweight, cast aluminum base, of the 'ring lapper' configuration, enabling high standards of flatness and surface finish.
The Blanchard 18 D Surface is a surface grinder used in Dicing & Grinding applications.