Lam Research
Concept One 200 PECVD-TEOS
What it is
General reference — not yet source-verifiedPECVD systems deposit thin films from reactive gases in a plasma environment. PECVD tools are used in semiconductor manufacturing when a dielectric or related film must be formed on patterned wafers at temperatures below those typical of many thermal deposition methods.
How it works
General reference — not yet source-verifiedPECVD deposition uses a plasma to activate precursor chemistry and form a solid film on the wafer surface. TEOS-based PECVD commonly uses organosilicon feed chemistry to produce silicon-oxide films, while related chamber configurations in this equipment class can also be used for silicon nitride deposition. Chamber designs in this class control gas flow, pressure, plasma power, temperature, and time to set film properties such as thickness, uniformity, and stress.
Where it fits in the process flow
General reference — not yet source-verifiedPECVD deposition sits in thin-film formation steps within front-end and back-end semiconductor process flows. PECVD dielectric films are commonly deposited after surface preparation and before patterning, etch, planarization, or metallization steps, depending on the layer being built.
Applications
General reference — not yet source-verifiedTEOS-based PECVD tools are used to form oxide films for insulation, passivation, and interlayer dielectric functions. PECVD dielectric tools in this class are also used for nitride deposition when configured for that chemistry, supporting barrier, passivation, and hard-mask related applications.
What do the numbers mean?
Power & electrical4
Wafer handling1
Gas & chemistry1
- Process
- PECVD-TEOS (Plasma-Enhanced Chemical Vapor Deposition - Tetraethyl Orthosilicate)[1]
Configuration & options5
- CCP/SiO, SiN[2]
What replaced it?
Alternatives
Tools documented as functional equivalents — same process step and wafer size, from a different manufacturer. Each equivalence cites its source.
- Applied Materials Producer SE— Same function class: Deposition, nullCompare in depthsource[1]
- Applied Materials P 5000 Mark II DLH— Same function class: Deposition, nullCompare in depthsource[1]
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What type of process is the Concept One 200 configured for?
The Concept One 200 is configured for PECVD-TEOS, expanded as plasma-enhanced chemical vapor deposition using tetraethyl orthosilicate.[1][2]
Not publicly documented
The following facts about the Concept One 200 PECVD-TEOS are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Concept One 200 PECVD-TEOS are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the Concept One 200 PECVD-TEOS are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the Concept One 200 PECVD-TEOS are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the Concept One 200 PECVD-TEOS are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the Concept One 200 PECVD-TEOS is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (2)Every fact above is drawn from these public sources
- [1]Inventory photo
- [2]inventory listing
Last updated Oct 21, 2026.
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