Laurell
SU-8
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
The Laurell SU-8 is a spin station used for coating substrates with SU-8 photoresist, an epoxy-based negative photoresist designed for micromachining and microelectronic applications requiring thick, chemically and thermally stable images. The SU-8 photoresist is a negative photoresist where parts exposed to UV become cross-linked, while the remainder remains soluble and can be washed away during development. SU-8 derives its name from the presence of 8 epoxy groups on average per moiety.[1][2]
Plate 01SU8 Calibration Guide
Eira -QianLiWatch on YouTubePlate 02SU8: How to finish a shop ceiling on a budget
Imagination IngrainedWatch on YouTube
How it works
SU-8 is a negative epoxy photoresist. The resist is exposed after coating, and the exposed portions crosslink during thermal processing before development removes the unexposed material.[2][1]
Where it fits in the process flow
The Laurell SU-8 fits in the lithography sequence after substrate preparation and coating and before exposure, post-exposure bake, and development. The SU-8 process flow includes spin coat, soft bake, expose, post-exposure bake, and develop.[2]
The FabLab lithography area also includes mask aligners, a maskless aligner, photoresist spin stations, a developing bench, and a photo oven. The Laurell SU-8 spin station belongs to that lithography group of tools.[3]
Applications
SU-8 is used for micromachining and other microelectronic applications where a thick chemically and thermally stable image is desired. The material is suited to high aspect ratio patterning and near vertical sidewalls.[2][1]
SU-8 is used in microfluidics, MEMS, bio-MEMS, and other microfabrication work. The resist can be processed with standard contact lithography at certain thicknesses and is commonly exposed with i-line ultraviolet light.[1][2]
Why won't it start?
Documented failure modes, common issues, and field considerations.
- Above 500 μm thickness, absorption leads to increasing sidewall undercuts and poor curing at the substrate interface
- SU-8 is very difficult to remove after full crosslinking
- Cracking and stress can occur due to thermal effects; controlled baking steps are required
What do the numbers mean?
Wafer handling1
Gas & chemistry3
Optics & imaging4
Configuration & options10
- Maximum Film Thickness (multiple coats or dry film)
- Up to above 300 μm (spun) or above 1 mm (dry film)[1]
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What does the Laurell SU-8 tool do?
The Laurell SU-8 tool is a spin station for SU-8 lithography coating.[3]
What process sequence is used for SU-8?
The SU-8 process sequence is spin coat, soft bake, expose, post-exposure bake, and develop.[2]
What kind of exposure is SU-8 optimized for?
SU-8 is optimized for i-line and broadband exposure, and i-line exposure tools are recommended.[2]
Not publicly documented
The following facts about the SU-8 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the SU-8 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the SU-8 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the SU-8 are not on record.
Answerable by: an engineer who operated it or OEM installation records
The process node or technology generation of the SU-8 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the SU-8 are on record.
Answerable by: an OEM parts catalog or a service engineer
Sources & citations
Sources (8)Every fact above is drawn from these public sources
- [1]en.wikipedia.org — en.wikipedia.orgen.wikipedia.org
- [2]wp.optics.arizona.edu — wp.optics.arizona.eduwp.optics.arizona.edu
- [3]nanocenter.umd.edu — nanocenter.umd.edunanocenter.umd.edu
- [4]cns1.rc.fas.harvard.educns1.rc.fas.harvard.edu
- [5]repository.upenn.edurepository.upenn.edu
- [6]iopscience.iop.orgiopscience.iop.org
- [7]Equipment | FabLab | Maryland NanoCenter — nanocenter.umd.edunanocenter.umd.edu
- [8]Equipment | FabLab | Maryland NanoCenter — nanocenter.umd.edunanocenter.umd.edu
Last updated Sep 30, 2026.
Compare with similar tools
View all →Brooks 017-0146-01 is a prealigner manufactured by Brooks.
The Ultratech 1000 Family is a photolithography step-and-repeat 1X steppers family using the Wynne Dyson optical design.
The EVG 101 is an advanced resist processing system for spin or spray coating and developing of wafers up to 300 mm.
