Laurell
SU-8
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
The Laurell SU-8 is a spin station used for coating substrates with SU-8 photoresist, an epoxy-based negative photoresist designed for micromachining and microelectronic applications requiring thick, chemically and thermally stable images. The SU-8 photoresist is a negative photoresist where parts exposed to UV become cross-linked, while the remainder remains soluble and can be washed away during development. SU-8 derives its name from the presence of 8 epoxy groups on average per moiety.[1][2]
Plate 01SU8 Calibration Guide
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Imagination IngrainedWatch on YouTube
What it is
General reference — not yet source-verifiedThe Laurell SU-8 spin station is a spin coater used for applying SU-8 photoresist to substrates.
How it works
General reference — not yet source-verifiedA spin coater operates by placing a substrate on a rotating chuck, dispensing a liquid photoresist onto the center of the substrate, and then spinning at high speed to spread the resist into a thin, uniform film through centrifugal force.
Applications
SU-8 photoresist is used in the fabrication of microelectromechanical systems (MEMS), microfluidics, bio-MEMS, and high-aspect-ratio microstructures. The Laurell spin station is employed to coat substrates with SU-8 for these applications.[1]
Why won't it start?
Documented failure modes, common issues, and field considerations.
- Above 500 μm thickness, absorption leads to increasing sidewall undercuts and poor curing at the substrate interface
- SU-8 is very difficult to remove after full crosslinking
- Cracking and stress can occur due to thermal effects; controlled baking steps are required
What do the numbers mean?
Wafer handling1
Gas & chemistry3
Optics & imaging4
Configuration & options10
- Maximum Film Thickness (multiple coats or dry film)
- Up to above 300 μm (spun) or above 1 mm (dry film)[1]
What does it need to run?
Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What film thicknesses can be achieved with SU-8 on this spin station?
For SU-8 formulations 2 through 25, film thicknesses ranging from 1.5 to 40 microns can be obtained by selecting appropriate spin speeds. For example, SU-8 2 at 3000 rpm yields about 1.5 microns, while SU-8 25 at 1000 rpm yields about 40 microns.[2]
What are the recommended soft bake parameters for SU-8?
Soft bake is performed on a hot plate using a two-step process: initially at 65°C, then at 95°C. Times depend on film thickness; for example, a 10-micron film of SU-8 10 requires 2 minutes at 65°C and 5-7 minutes at 95°C.[2]
Not publicly documented
The following facts about the SU-8 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the SU-8 are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the SU-8 are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the SU-8 are not on record.
Answerable by: an engineer who operated it or OEM installation records
The process node or technology generation of the SU-8 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the SU-8 are on record.
Answerable by: an OEM parts catalog or a service engineer
Sources & citations
Sources (8)Every fact above is drawn from these public sources
- [1]en.wikipedia.org — en.wikipedia.orgen.wikipedia.org
- [2]wp.optics.arizona.edu — wp.optics.arizona.eduwp.optics.arizona.edu
- [3]nanocenter.umd.edu — nanocenter.umd.edunanocenter.umd.edu
- [4]cns1.rc.fas.harvard.educns1.rc.fas.harvard.edu
- [5]repository.upenn.edurepository.upenn.edu
- [6]iopscience.iop.orgiopscience.iop.org
- [7]Equipment | FabLab | Maryland NanoCenter — nanocenter.umd.edunanocenter.umd.edu
- [8]Equipment | FabLab | Maryland NanoCenter — nanocenter.umd.edunanocenter.umd.edu
Last updated Aug 14, 2026.
