WS-65

The Laurell WS-65 is a spin coater. The Laurell WS-65 is intended for coating photoresist on samples of various sizes.^[1][2][3]

The Laurell WS-65 uses a vacuum chuck to hold the substrate during coating. The Laurell WS-65 uses a digital process controller with a speed range of 100 to 8000 rpm and 0.5 rpm resolution. The Laurell WS-65 controller can store up to twenty programs with up to 51 steps each. The Laurell WS-65 uses a 1.75 inch natural propylene vacuum chuck that holds substrates from 50 mm through 150 mm. The Laurell WS-65 can hold up to a 6 inch wafer or a 4 inch square substrate. The Laurell WS-65 is equipped with fragment adapters for 1 inch by 3 inch microscope slides and for pieces from 10 mm through 50 mm. The Laurell WS-65 also has a wafer alignment tool. The Laurell WS-65 uses EPDM O-rings for common solvent systems and Viton O-rings for acids, CH2Cl2, chloroform, THF, and toluene systems.^[1][2]

The Laurell WS-65 has a lid interlock switch that prevents operation when the lid is not closed. The Laurell WS-65 displays an error message if vacuum is low, if compressed air pressure is low, or if the lid is open. The Laurell WS-65 displays a Done message when the process is completed. The valve and sensor parameters are not applicable to this spin processor.^[1][2]

Spin coating is typically used after substrate cleaning and preparation and before soft bake, exposure, development, etch, lift-off, or deposition steps, depending on the process. In lithographic work, a spin coater commonly sits at the resist-apply stage near the start of the patterning sequence.

The Laurell WS-65 is intended for coating photoresist on samples of various sizes. The Laurell WS-65 operating instructions also refer to dispensing photoresist or other chemicals onto the substrate.^[1][2]