DS 271

Dicing and grinding machines are production tools used to shape, thin, and separate workpieces that have already been processed on a carrier or wafer substrate. In this class, the machine supports the transition from larger processed material into smaller, usable parts.

The class includes systems that combine precision motion, abrasive or cutting action, coolant handling, and process control. Such machines are used where accurate material removal and controlled edge quality are required.

Machines of this class use a controlled moving stage to present the workpiece to a cutting or grinding element. Dicing operations remove material along defined lines to divide a substrate into individual parts, while grinding operations remove material from a surface to reduce thickness or improve flatness.

The process depends on accurate alignment, stable fixturing, and continuous control of feed motion and tool engagement. Coolant or other process fluid is commonly used to manage debris, reduce heat, and support cut quality during material removal.

This class of machine is typically used after front-end fabrication steps and before downstream handling, assembly, or packaging. It sits near the end of the wafer or substrate flow, where the goal is to prepare individual devices or thinned workpieces for the next stage.

Machines of this class are generally used for semiconductor wafers, compound semiconductor substrates, and other precision materials that must be separated or thinned with controlled edge and surface quality. They are also used in related electronics and optoelectronics manufacturing where accurate singulation and thickness control are required.