Waferpedia

Manufacturer

Meyer Burger

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16 entries

  1. DW 288 Wire CuttingMeyer Burger

    The Meyer Burger DW 288 S4 multi wire saw is designed for slicing semiconductor silicon and sapphire into wafers.

    CategoryDicing & Grinding
  2. 600Meyer Burger
  3. TR 4 700 DiamondMeyer Burger
    CategoryDicing & Grinding
  4. TS 3 OD SlicingMeyer Burger
  5. DS 264 TrolleyMeyer Burger
  6. TS 3Meyer Burger
  7. AK 800Meyer Burger

    The Meyer Burger AK 800 is an etcher.

    CategoryEtch
  8. DS 265 MultiMeyer Burger
    CategoryDicing & Grinding
  9. DW 288 S 4 DiamondMeyer Burger
    CategoryDicing & Grinding
  10. DW 288 Diamond Wire SlicerMeyer Burger
  11. TS 23 IDMeyer Burger
    CategoryDicing & Grinding
  12. DS 266Meyer Burger
    CategoryDicing & Grinding
  13. TS 121Meyer Burger
    CategoryDicing & Grinding
  14. DS 271Meyer Burger

    The Meyer Burger DS 271 is a wire saw with HDD and software.

    CategoryDicing & Grinding
  15. TS 202 IDMeyer Burger
    CategoryDicing & Grinding
  16. OC 266 WaferMeyer Burger
    CategoryDicing & Grinding