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Manufacturer

Meyer Burger

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16 entries

  1. DW 288 Wire CuttingMeyer Burger

    The Meyer Burger DW 288 S4 multi wire saw is designed for slicing semiconductor silicon and sapphire into wafers.

    CategoryDicing & Grinding
  2. 600Meyer Burger
  3. AK 800Meyer Burger

    The Meyer Burger AK 800 is an etcher.

    CategoryEtch
  4. DS 264 TrolleyMeyer Burger

    The Meyer Burger DS 264 Trolley is a semiconductor manufacturing equipment model from Meyer Burger, for which no detailed specifications have been publicly documented.

  5. TS 202 IDMeyer Burger

    The Meyer Burger TS 202 ID Saw is an ID saw from Meyer Burger, with a vintage of 1996.

    CategoryDicing & Grinding
  6. DS 265 MultiMeyer Burger

    Meyer Burger DS 265 Multi is a wire saw in the Dicing & Grinding category. Meyer Burger DS 265 Multi has a documented electrical specification of 400 V, 85 A, and 50/60 Hz.

    CategoryDicing & Grinding
  7. TR 4 700 DiamondMeyer Burger
    CategoryDicing & Grinding
  8. TS 3Meyer Burger
  9. TS 3 OD SlicingMeyer Burger

    The Meyer Burger TS 3 OD Slicing is a semiconductor equipment model from Meyer Burger.

  10. DW 288 S 4 DiamondMeyer Burger

    The Meyer Burger DW 288 S 4 Diamond Wire Saw is a multi wire saw for smart slicing of sapphire and other hard and brittle materials. The Meyer Burger DW 288 S 4 uses sophisticated work piece rocking, optional diamond wire management, and options for adaptive feed or a slurry media module.

    CategoryDicing & Grinding
  11. TS 23 IDMeyer Burger

    The Meyer Burger TS 23 is an ID saw (inner diameter saw).

    CategoryDicing & Grinding
  12. OC 266 WaferMeyer Burger

    The Meyer Burger OC 266 Wafer is a wafer saw in the Dicing & Grinding category.

    CategoryDicing & Grinding
  13. DW 288 Diamond Wire SlicerMeyer Burger

    The Meyer Burger DW 288 Diamond Wire Slicer is a diamond wire slicer with documented 60 Hz, 440V, and 110 kW electrical specifications.

  14. TS 121Meyer Burger

    General referenceThe Meyer Burger TS 121 is a dicing and grinding system used in semiconductor manufacturing for wafer singulation and thinning.

    CategoryDicing & Grinding
  15. DS 271Meyer Burger

    The Meyer Burger DS 271 is a wire saw with HDD and software.

    CategoryDicing & Grinding
  16. DS 266Meyer Burger

    The Meyer Burger DS 266 is a wire saw used for wafer dicing, available with electrical specifications of 400V, 120A, and 50 Hz.

    CategoryDicing & Grinding