Meyer Burger
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The Meyer Burger TS 23 ID Saw is an inner-diameter saw used in semiconductor dicing processes.[1][2][3][4]

An ID saw is a precision cutting machine used to slice brittle materials with a circular blade whose cutting edge is formed on the inner diameter. ID saws are commonly used where controlled kerf, stable blade geometry, and careful handling of hard or fragile workpieces are important.
An ID saw operates by rotating a tensioned ring blade and feeding the workpiece into the blade opening so the inner cutting edge performs the cut. ID saws generally use precise fixturing, controlled feed motion, and coolant during cutting to manage heat, debris, and edge quality.
ID sawing is typically a singulation or slicing step that follows crystal growth, ingot preparation, or substrate preparation, depending on the product being made. ID sawing generally precedes lapping, grinding, polishing, cleaning, inspection, or downstream assembly steps that require dimensioned pieces or separated parts.
ID saws are used for precision cutting of brittle crystalline and ceramic materials in semiconductor and related manufacturing. ID saws are commonly applied where wafers, bars, blocks, or substrates must be sectioned with controlled damage and consistent geometry before later thinning or finishing operations.
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The following facts about the TS 23 ID are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the TS 23 ID are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the TS 23 ID are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the TS 23 ID are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the TS 23 ID are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the TS 23 ID is not on record.
Answerable by: an OEM datasheet or a fab qualification report
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Last updated Oct 19, 2026.
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