Nikon
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In a lithography line, this class of tool exposes a photosensitive wafer surface through a patterned optical system so circuit features can be replicated layer by layer.
A lithography scanner projects a circuit pattern from a mask or reticle onto a photoresist-coated wafer using precision optics, motion control, and tightly regulated alignment. Immersion lithography places a fluid between the final projection lens and the wafer to improve imaging performance for small feature patterning.
The scanner steps or scans the wafer in coordination with the projected image so successive exposures can cover the full substrate. Alignment and focus control keep each layer registered to earlier patterned layers.
This type of equipment sits in the front end of semiconductor fabrication, after wafer preparation and photoresist coating, and before development and etch or deposition steps that use the patterned resist as a transfer template.
Its output is a latent image in the resist that defines where later process steps will remove or build material to form device structures.
Immersion lithography scanners are used for advanced integrated-circuit patterning on silicon wafers, including critical layers that require fine feature placement and tight overlay control.
A tool in this class is generally used for high-resolution device fabrication in logic, memory, and other semiconductor manufacturing flows that depend on repeated optical pattern transfer.
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The model designation is Nikon NSR S 621 D.[1]
The following facts about the NSR S 621 D Immersion are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No specifications for the NSR S 621 D Immersion are on record.
Answerable by: an OEM datasheet, a cleanroom equipment inventory, or an engineer who operated or installed it
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the NSR S 621 D Immersion are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the NSR S 621 D Immersion are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the NSR S 621 D Immersion are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the NSR S 621 D Immersion are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
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Last updated Jul 30, 2026.
The EVG 101 is an advanced resist processing system for spin or spray coating and developing of wafers up to 300 mm.