Waferpedia

PR Hoffman

106T

Email
PR Hoffman106T
No photo available yet

What it is

General reference — not yet source-verified

A carrier of this class is a workholding plate used in double-sided planetary lapping or polishing. A carrier of this class holds parts in cutouts while the parts move between opposing laps or polishing plates. A carrier of this class helps maintain part spacing, supports parallel processing, and controls how the workpieces are presented to the abrasive surfaces.

Where it fits in the process flow

General reference — not yet source-verified

A carrier of this class sits inside the material-removal stage of double-sided lapping or polishing. A carrier of this class is used after parts have been sliced, molded, pressed, or otherwise prepared as blanks and before final cleaning, inspection, or later finishing operations. A carrier of this class supports simultaneous processing of many parts when both major faces need flatness and parallelism control.

Applications

General reference — not yet source-verified

Carriers of this class are used where a process needs both faces of a part finished together. Carriers of this class are common for wafers, substrates, ceramics, glass, metals, and other flat workpieces that must be thinned, flattened, or polished with controlled face-to-face geometry.

  • double-sided planetary lapping
  • double-sided planetary polishing

What do the numbers mean?

Wafer handling5

Carrier type
insert carrier; lapping carrier[1]
Accurate?
Category
insert carrier / lapping carrier[2]
Accurate?
Wafer size
3 in, 4 in, 5 in, 6 in, 8 in, 12 in[2]
Accurate?
Insert carrier type list entry
106T 2400 - 106T PR Hoffman[1]
Accurate?
Lapping carrier type list entry
106T 2400 - 106T PR Hoffman[3]
Accurate?

Configuration & options4

OEM
PR Hoffman[1]2 sources
Accurate?
Model
106T[1]2 sources
Accurate?
Listed machine type
double-sided planetary lapping & polishing machines; double-sided planetary lapping machines[1]
Accurate?
Listed machine type
double-sided planetary lapping and polishing machines; double-sided planetary lapping machines[2]
Accurate?
Interested in this tool?
Need help with this tool?Embed spec card

Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

No research found yet — worked with this tool? Share what you know.

Worked with this tool? Help preserve its knowledge →

Frequently asked questions

What is the PR Hoffman 106T?

The PR Hoffman 106T is an insert carrier and lapping carrier type.[1][3][2][4]

Not publicly documented

The following facts about the 106T are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 106T are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • No publicly documented variants, configuration options, or revision breakpoints of the 106T are on record.

    Answerable by: an OEM product catalog or an engineer who ordered or specified the tool

  • The control-system platform and OS era of the 106T are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the 106T are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

  • The process node or technology generation of the 106T is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

No research found yet — worked with this tool? Share what you know.

Sources & citations

Sources (4)Every fact above is drawn from these public sources
  1. [1]web.archive.org — web.archive.orgweb.archive.org
  2. [2]waferpedia.com — waferpedia.comwaferpedia.com
  3. [3]web.archive.org — web.archive.orgweb.archive.org
  4. [4]PR Hoffman 106T family | Waferpedia — waferpedia.comwaferpedia.com
Was this page accurate?

Last updated Oct 17, 2026.

Compare with similar tools

View all →