Raith
Raith 3D is a nanoengineering EBL tool. Raith 3D has a 30 kV acceleration voltage. Raith 3D uses a Gemini electron column.[1][2]

Electron beam lithography tools write patterns directly into electron-sensitive resist by scanning a focused electron beam under computer control. Electron beam lithography belongs to the patterning part of nanofabrication and is commonly used where maskless writing, flexible geometry definition, and research-oriented process development are important.
Electron beam lithography tools form patterns by steering a narrow beam across a resist-coated sample and locally changing the resist chemistry. Electron beam lithography tools commonly support imaging for navigation, alignment, and inspection in the same chamber. Nanoengineering configurations in this class can also extend beyond resist exposure into beam-assisted modification, localized deposition, or probing workflows on prepared samples.
Electron beam lithography tools are typically used after substrate preparation and resist coating, and before resist development and pattern transfer or lift-off. Electron beam lithography tools often serve research and prototype flows where direct writing is preferred over photomask-based exposure, and where users need to iterate layouts or fabricate specialized nanoscale structures.
Electron beam lithography tools are used for resist patterning in nanodevice development, photonic structures, test structures, and custom small-batch fabrication. Nanoengineering variants of this class are also used for exploratory process work that combines writing, imaging, and localized beam-driven modification on the same platform.
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The following facts about the 3D are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 3D are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the 3D are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the 3D are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 3D are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 3D is not on record.
Answerable by: an OEM datasheet or a fab qualification report
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Last updated Oct 16, 2026.