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Raith

3D

Nanoengineering EBL toolRaith 3D family
Research Quality: 40% complete
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3D — web.archive.org
Fig. 013Dweb.archive.org[1]

Power

30 kV[1]

Optics

Gemini electron column[1]

What is it?

The eLINE Plus is described as a versatile nanolithography system for universities and research centers, combining electron beam lithography with an open platform for optional nanofabrication processes and techniques in a single tool. The source states that it includes fully integrated nanomanipulators, a gas injection system for FEBIP processes, multiple detector concepts, and Raith NanoSuite software, and that it is used for nanolithography, nanoengineering, nanomanipulation, nanoprobing, nanoprofilometry, focused electron beam induced processes, and SEM imaging and analysis.

What can it run?

Process applications and technology nodes documented for this tool.

  • Nanolithography
  • Nanoengineering
  • Nanomanipulation
  • Nanoprobing
  • Nanoprofilometry
  • Focused Electron Beam Induced Processes (FEBIP)
  • SEM imaging and analysis

What do the numbers mean?

Power & electrical1

Acceleration voltage
30 kV[1]
Accurate?

Optics & imaging4

Column technology
Gemini electron column[1]
Accurate?
Beam size
1.6 nm[1]
Accurate?
Detector
Inlense SE detector[1]
Accurate?
Detector option
Energy selective BSE (EsB) detector option[1]
Accurate?

Configuration & options2

Stage
4" full travel; large Z travel; rotation and tilt option[1]
Accurate?
Writing mode
traxx; periodixx[1]
Accurate?
Interested in this tool?
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What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

  • Acceleration voltage30 kV[1]

Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

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Not publicly documented

The following facts about the 3D are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 3D are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • No publicly documented variants, configuration options, or revision breakpoints of the 3D are on record.

    Answerable by: an OEM product catalog or an engineer who ordered or specified the tool

  • The control-system platform and OS era of the 3D are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the 3D are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

  • The process node or technology generation of the 3D is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

No research found yet — worked with this tool? Share what you know.

Sources & citations

Sources (1)Every fact above is drawn from these public sources
  1. [1]web.archive.org — web.archive.orgweb.archive.org
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Last updated Jul 29, 2026.