Waferpedia

Manufacturer

Shinkawa

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18 entries

  1. UTC 3000 WEShinkawa

    The Shinkawa UTC 3000 WE Bonder is a wire bonder for 8-inch wafers.

    CategoryPackaging & Bonding
  2. UTC 475 BI SuperShinkawa
    CategoryPackaging & Bonding
  3. UTC 3000Shinkawa
    CategoryPackaging & Bonding
  4. UTC 2000Shinkawa
    CategoryPackaging & Bonding
  5. SBB 1410 Stud BumpShinkawa
    CategoryPackaging & Bonding
  6. UTC 400 BIShinkawa
    CategoryPackaging & Bonding
  7. UTC 300 BIShinkawa
    CategoryPackaging & Bonding
  8. UTC 200 BI Super IIShinkawa
    CategoryPackaging & Bonding
  9. UTC 200 SuperShinkawa
    CategoryPackaging & Bonding
  10. COF 300 Flip ChipShinkawa
    CategoryPackaging & Bonding
  11. SIL 1323Shinkawa
  12. Super ACB 1000Shinkawa
    CategoryPackaging & Bonding
  13. ACB 1000Shinkawa
    CategoryPackaging & Bonding
  14. 8-inchShinkawa

    Shinkawa 8-inch package sorter for mold CSP and wafer level CSP applications.

    CategoryPackaging & BondingWafer8-inch
  15. UTC 1000Shinkawa

    The Shinkawa UTC 1000 is a wire bonder with ultrasonic thermo compression bonding.

    CategoryPackaging & Bonding
  16. UTC 1000 SuperShinkawa
    CategoryPackaging & Bonding
  17. UTC 2000 SuperShinkawa
    CategoryPackaging & Bonding
  18. UTC 5000Shinkawa
    CategoryPackaging & Bonding