Shinkawa
UTC 3000 WE
Provisional entry — research in progress
This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.
What it is
The UTC 3000 WE supports 8-inch wafers and is a bonder produced by Shinkawa.[1]
How it works
General reference — not yet source-verifiedWire bonders of this class operate by feeding a thin wire through a capillary, forming a ball at the tip via electric discharge, then pressing and ultrasonically welding the ball onto a bond pad on the die. The capillary then moves to the corresponding pad on the substrate or leadframe and forms a second bond (stitch or wedge), leaving a loop of wire between the two points.
Where it fits in the process flow
General reference — not yet source-verifiedIn semiconductor manufacturing, the wire bonding step follows die attach within the packaging process. After a die is attached to a package substrate or leadframe, the bonder creates the electrical interconnections. Downstream processes include encapsulation (molding), testing, and final singulation.
Applications
General reference — not yet source-verifiedThe Shinkawa UTC 3000 WE is used in the assembly of a wide range of semiconductor packages, including quad flat packages (QFP), ball grid arrays (BGA), and other leaded or leadless packages that require fine-pitch wire interconnections.
What do the numbers mean?
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
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Not publicly documented
The following facts about the UTC 3000 WE are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
Fewer than 3 independently cited specifications for the UTC 3000 WE are on record; the remainder await public documentation.
Answerable by: an OEM datasheet, a cleanroom equipment inventory, or an engineer who operated or installed it
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the UTC 3000 WE are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the UTC 3000 WE are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the UTC 3000 WE are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the UTC 3000 WE are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (1)Every fact above is drawn from these public sources
- [1]Equipment inventory listing
Last updated Aug 20, 2026.
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